Supermicro · 21 hours ago
Staff Data Center Design Engineer
Supermicro is a leading provider of advanced server, storage, and networking solutions for various sectors including Data Center and Cloud Computing. They are seeking a highly skilled Staff Data Center Design Engineer to lead the mechanical design and simulation for high-density, liquid-cooled data center infrastructure, ensuring integration of electrical components and adherence to industry standards.
Artificial Intelligence (AI)Cloud ComputingCloud InfrastructureEmbedded SystemsManufacturingSoftware
Responsibilities
Lead mechanical design for 3D assemblies including rack structures, cooling manifolds, tubes, hoses, and connectors
Ensure full integration of electrical components such as power shelves, busbars, BBUs, and inverters within 3D designs
Design and simulate liquid cooling systems (e.g. CDM) with attention to layout, flow optimization, and material compatibility
Develop digital twin models to simulate airflow, thermal behavior, and system interactions across rack and room levels
Perform CFD simulations using Cadence (Future Facilities) and similar tools to validate thermal performance
Conduct FEA simulations to evaluate structural integrity, mechanical stress under operational loads, and thermal expansion effects due to fluid temperature differentials
Document design outputs including detailed 3D models, 2D drawings, BOMs, simulation results, and test documentation
Ensure adherence to OCP, ASHRAE, and EIA standards and incorporate into mechanical design practices
Coordinate closely with hardware, electrical, and facility teams to ensure successful end-to-end design integration
Lead design reviews and support product development cycles through manufacturing, testing, and deployment
Support prototyping through 3D printing and other fabrication methods
Mentor junior mechanical and simulation engineers
Contribute to continuous improvement of design templates, simulation workflows, and documentation standards
Stay up to date with new industry standards, cooling technologies, and materials science relevant to liquid cooling and high-density infrastructure
Participate in vendor evaluation, equipment benchmarking, and component selection
Qualification
Required
Bachelor's or Master's degree in Mechanical Engineering or related field
Minimum 12 years of experience in mechanical design for data centers or high-performance computing environments
Expert-level proficiency with SolidWorks or equivalent 3D CAD tools
Experience with CFD simulation using Cadence (Future Facilities) or equivalent tools
Strong understanding of FEA principles and application
Deep knowledge of liquid cooling systems including CDMs, tubes, connectors, and material compatibility
Experience with power infrastructure elements such as BBUs, inverters, power shelves, and busbars
Familiarity with OCP, ASHRAE, and EIA standards
Excellent communication skills and cross-functional collaboration ability
Ability to work independently and lead key aspects of complex technical projects
Preferred
Experience developing and managing digital twin environments for mechanical systems
Proficiency in 3D printing, prototyping, and thermal testing workflows
Prior experience in rack-level thermal optimization or modular cooling design
Familiarity with BIM/Revit and integration of 3D mechanical models into facility-level planning
Demonstrated success in end-to-end delivery of mechanical designs for hyperscale or AI data centers
Benefits
Comprehensive benefits package
Participation in bonus and equity award programs
Company
Supermicro
Supermicro is a global leader in high-performance, high-efficiency server technology and innovation.
H1B Sponsorship
Supermicro has a track record of offering H1B sponsorships. Please note that this does not
guarantee sponsorship for this specific role. Below presents additional info for your
reference. (Data Powered by US Department of Labor)
Distribution of Different Job Fields Receiving Sponsorship
Represents job field similar to this job
Trends of Total Sponsorships
2025 (35)
2024 (33)
2023 (27)
2022 (29)
2021 (30)
2020 (42)
Funding
Current Stage
Public CompanyTotal Funding
$6.5B2026-01-06Post Ipo Debt· $2B
2025-06-24Post Ipo Debt· $2.3B
2025-02-11Post Ipo Debt· $700M
Leadership Team
Recent News
2026-01-07
2026-01-06
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