Celestial AI · 2 months ago
Package Design Engineer
Santa Clara, CA
Full-time
Onsite
Senior Level
$195K/yr - $235K/yr
5+ years expCelestial AI is a company focused on advancing Generative AI and data center infrastructure. They are seeking an experienced Package Designer to drive their Photonic Fabric Package solutions, collaborating with various engineering groups to ensure design for manufacturing, assembly, and reliability.
Semiconductors
Responsibilities
Lead Si/package/PCB/system co-design work collaborating with downstream system design teams and upstream ASIC designers to develop a portfolio of packages that meets a huge range of performance design points, while optimizing re-use in other Celestial AI products
Scope all aspects of package design feasibility at Silicon interposer and substrate level for multi-chip SiP packaging
Support pre/post silicon bring up, yield improvement activities, qualification, failure analysis, and system implementation
Lead all aspects of package layout based on I/O, SI-PI and form factor requirements, including routing, design for reliability, thermal, mechanical, manufacturability, bumping, substrate, material selection, assembly, and support for testing
Meet specifications for high-speed interfaces such as HBM, DDR, PCIe and 56G/112G SerDes
Plan and execute Silicon interposer and RDL based design layout solutions for advanced packaging architectures
Netlist management for heterogeneous chiplet assemblies using latest EDA solutions
Supporting activities related to production and assembly of IC packages with substrate suppliers and OSATs
Work with cross-functional teams and support package integration and architecture efforts with vendors
Actively participate in qualification of package and board level assembly with sensitivity to physics of failures for high thermo-mechanical reliability, driving appropriate test vehicle definition and design
Drive ideation and innovation of advanced package solutions and specifications with vendors to advance productization efforts by Celestial AI
Qualification
Required
BS/MS/PhD in EE/ECE/MSE/ME/ChemE or related disciplines
5-10 years of experience in Semiconductor Packaging Design of heterogeneous architectures, including silicon interposer and RDL designs
Extensive experience working with advanced packaging design tools such as Cadence APD
Experience working with MCAD tools such as SolidWorks, AutoCAD and interconversion of package design databases to MCAD files
Knowledge and insights to deliver high density/high performance interconnects in various 2.5D/3D packaging technologies including InFO, CoWoS, FoCoS and EMIB
Good understanding of cross-functional packaging areas: Si floor plan, package, board layout and architecture, design rules, BOM, enabling material/process technologies, thermal, mechanical, Signal/Power Integrity, design for manufacturing, assembly, reliability, and cost
Proven track record of working with substrate vendors to meet design for manufacturing, yield, and reliability
Proven track record of engagement with OSATs to meet assembly requirements and drive new developments to meet new product requirements
Experience in High Speed Signaling best practices, Signal and Power integrity requirements
Strong analytical, problem-solving, cross-functional collaboration, project management, and technical presentation skills
Preferred
Expertise in heterogeneous integration, fan-out packaging, chiplet architectures – co-design, layout, and netlist management
Knowledge of Signal and Power Integrity
Experience in substrate vendor and OSAT assembly engagement to meet manufacturing and assembly requirements
Benefits
Health, vision, dental and life insurance
Collaborative and continuous learning work environment
Company
Celestial AI
AI is touching our lives and driving breakthroughs in healthcare, finance, autonomous systems, and countless other domains.
51-200 employees
H1B Sponsorship
Celestial AI has a track record of offering H1B sponsorships. Please note that this does not
guarantee sponsorship for this specific role. Below presents additional info for your
reference. (Data Powered by US Department of Labor)
Distribution of Different Job Fields Receiving Sponsorship
Represents job field similar to this job
Trends of Total Sponsorships
2025 (15)
2024 (10)
2023 (4)
2022 (7)
2021 (1)
Funding
Current Stage
Growth StageLeadership Team
David Lazovsky
Founder, CEO
Recent News
Venture Capital Access Online
2025-03-13
2025-03-13
Company data provided by crunchbase