CelLink Corporation · 2 months ago
Process Development Engineer (Surface-Mount Technology)
San Carlos, CA
Full-time
Onsite
Mid, Senior Level
$130K/yr - $160K/yr
3+ years expCelLink Corporation is redefining how power and data move through advanced electronics. As a Process Development Engineer, you will develop and scale manufacturing processes for flex-circuit-based interconnects used in high-density server and rack systems, ensuring reliability and performance in next-generation AI and data infrastructure.
Electric VehicleElectronicsHardwareManufacturing
Responsibilities
Develop and tune reflow soldering profiles for advanced power-electronic assemblies, including large copper mass and mixed SMT/through-hole designs
Own the setup, operation, and troubleshooting of reflow ovens, solder paste printing, and other process equipment
Analyze thermal profiles and cross-sections to correlate process parameters with solder joint reliability
Develop and optimize lamination and bonding processes, including press setup, adhesive cure control, and layer alignment
Diagnose and correct leakage, delamination, and voiding issues in laminated or sealed cooling-plate assemblies
Design and release tooling, coupons, and test fixtures in CAD (SolidWorks preferred) to support process development and validation
Interpret and create engineering drawings and GD&T to ensure correct fit, form, and function
Define and execute DOE and characterization tests, including electrical, mechanical, thermal, and visual inspection
Lead root-cause analysis and corrective actions across soldering, lamination, and bonding processes
Collaborate with Design, Quality, and Operations to transition new processes into scalable production
Maintain a clean, organized work area and adhere to all safety and environmental standards
Demonstrate CelLink’s core values of integrity, teamwork, self-discipline, and technical excellence
Perform additional duties as assigned to support evolving business needs
Qualification
Required
Bachelor's degree in Mechanical Engineering, Manufacturing Engineering, Materials Science, or related field
3–7 years of experience in process engineering for electronics manufacturing, ideally in high-speed interconnects, flex circuits, or PCB production
Experience with data center or high-current electrical component manufacturing is a strong plus
Deep knowledge of flexible circuit manufacturing, roll-to-roll processes, or high-reliability electronics
Familiarity with power interconnects, busbars, or cable harness replacements used in data center systems
Proficiency in data analysis tools (Excel, JMP, Python preferred) and engineering software (SolidWorks, AutoCAD, Minitab, etc.)
Strong problem-solving and analytical skills with the ability to lead cross-functional investigations and corrective actions
Excellent communication and documentation skills for technical reporting and collaboration
Proven ability to thrive in a fast-paced, hands-on, and highly technical environment
Preferred
Experience with cooling plates, liquid-cooled assemblies, or leak-test methods (helium, pressure decay, bubble, or dye)
Background in high-current or high-voltage electronics, such as busbars, power modules, or battery interconnects
Familiarity with thermal characterization, pull/shear testing, or cross-section analysis
Exposure to laser soldering, selective soldering, or bonded multilayer assemblies
Benefits
Stock Option
Company
CelLink Corporation
CelLink’s high-conductance flexible circuits consolidate busing, fusing, voltage monitoring, and temperature sensing into a single integrated solution.
201-500 employees
H1B Sponsorship
CelLink Corporation has a track record of offering H1B sponsorships. Please note that this does not
guarantee sponsorship for this specific role. Below presents additional info for your
reference. (Data Powered by US Department of Labor)
Distribution of Different Job Fields Receiving Sponsorship
Represents job field similar to this job
Trends of Total Sponsorships
2025 (10)
2024 (5)
2023 (5)
2022 (8)
2021 (2)
2020 (2)
Funding
Current Stage
Late StageTotal Funding
$659.22MKey Investors
US Department of EnergyWhale Rock Capital ManagementFranklin Templeton
2023-05-12Debt Financing· $362M
2022-02-16Series D· $250M
2021-05-03Series C· $24.72M
Leadership Team
Malcolm Brown
Co-founder and VP Engineering
Recent News
2025-09-12
2025-07-29
Company data provided by crunchbase