Physical Design Methodology Engineer jobs in United States
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AMD · 2 months ago

Physical Design Methodology Engineer

AMD is a leading company in the technology sector focused on building innovative products for next-generation computing experiences. The Physical Design Methodology Engineer will develop methodologies for advanced nodes and High Performance Computing SOCs, collaborating with various engineering teams to ensure successful silicon outcomes.

AI InfrastructureArtificial Intelligence (AI)Cloud ComputingComputerEmbedded SystemsGPUHardwareSemiconductor
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Growth Opportunities
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H1B Sponsor Likelynote

Responsibilities

Physical design and signoff methodology development for advanced nodes and High performance
Automation to improve design PPA (Power, Performance, Area) and ensure a high-quality design environment for an SOC
Full chip / sub-system/ Tile level timing analysis with bleeding edge STA methodologies
Full chip / sub system level Clock tree synthesis and advanced clock tree construction and analysis
Block and top level Formal verification, Physical Verification and chip finishing methodologies
Top level ECO strategy for RTL, pre-physical and post-route implementation considering timing, congestion, IRdrop and logic equivalence
Statistical and Static Timing Analysis, Variation aware analysis, stdcell Library characterization enhancements
Developing and Integrating ML and LLM applications for Physical Design and Analysis flows
Performing data analysis and identifying design trends
Customizing and implementing solutions for new challenges
Collaborating with multi-site engineering teams to reach project goals
Hands-on in reference flows, excellent debugging skills
Maintain and update technology collaterals

Qualification

ASIC Physical DesignTiming AnalysisPhysical VerificationScripting TCLScripting PerlScripting PythonMLLLM KnowledgeData AnalyticsCommunication SkillsProblem-Solving SkillsDetail-Oriented

Required

Physical design and signoff methodology development for advanced nodes and High performance
Automation to improve design PPA (Power, Performance, Area) and ensure a high-quality design environment for an SOC
Full chip / sub-system/ Tile level timing analysis with bleeding edge STA methodologies
Full chip / sub system level Clock tree synthesis and advanced clock tree construction and analysis
Block and top level Formal verification, Physical Verification and chip finishing methodologies
Top level ECO strategy for RTL, pre-physical and post-route implementation considering timing, congestion, IRdrop and logic equivalence
Statistical and Static Timing Analysis, Variation aware analysis, stdcell Library characterization enhancements
Developing and Integrating ML and LLM applications for Physical Design and Analysis flows
Performing data analysis and identifying design trends
Customizing and implementing solutions for new challenges
Collaborating with multi-site engineering teams to reach project goals
Hands-on in reference flows, excellent debugging skills
Maintain and update technology collaterals
Bachelors or Masters degree in computer engineering/Electrical Engineering

Preferred

Experience in ASIC Physical Design and/or CAD development
Hands-on experience with Place and Route, Timing Analysis, and Physical Verification tools from Synopsys, Cadence, like ICC2, Fusion Compiler, DSO.AI, Innovus, Cerebrus, Primetime, Primeshield, PT-PX, Formality, Conformal, RedHawk, etc
Experience in 5nm and below technologies
Script development, scripting (TCL, Perl, Python, Pandas), ML/AI techniques
Knowledge and Experience in ML and LLM
Experience with data analytics applications, database management

Benefits

AMD benefits at a glance

Company

Advanced Micro Devices is a semiconductor company that designs and develops graphics units, processors, and media solutions.

H1B Sponsorship

AMD has a track record of offering H1B sponsorships. Please note that this does not guarantee sponsorship for this specific role. Below presents additional info for your reference. (Data Powered by US Department of Labor)
Distribution of Different Job Fields Receiving Sponsorship
Represents job field similar to this job
Trends of Total Sponsorships
2025 (836)
2024 (770)
2023 (551)
2022 (739)
2021 (519)
2020 (547)

Funding

Current Stage
Public Company
Total Funding
unknown
Key Investors
OpenAIDaniel Loeb
2025-10-06Post Ipo Equity
2023-03-02Post Ipo Equity
2021-06-29Post Ipo Equity

Leadership Team

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Lisa Su
Chair & CEO
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Mark Papermaster
CTO and EVP
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Company data provided by crunchbase