Northrop Grumman · 2 months ago
Characterization Fab Engineer Level 1 or 2 (2nd shift) - R10213779
Linthicum Heights, MD
Full-time
Onsite
New Grad, Entry, Mid Level
$71K/yr - $128K/yr
0+ years expNorthrop Grumman is a leading company in technological advancements, seeking a Characterization Fab Engineer Level 1 or 2 for their Advanced Technology Lab in Linthicum, MD. The role involves hands-on work in the cleanroom, focusing on defect metrology and supporting semiconductor product development.
AerospaceData IntegrationManufacturingRemote SensingSecurity
No H1B
Security Clearance RequiredU.S. Citizen Only
Responsibilities
Being the first line of defense for the Characterization Engineering fab issues, spending upwards of 60-70% of shift in the cleanroom
Maintain existing and creating new in-line metrology and defect metrology recipes and techniques
Be hands-on with microscopes for visible inspection
Assisting with ongoing efforts to integrate in-line defect metrology into our process flows
Supporting operations in addressing lot holds across the fleet of Characterization Engineering tool sets
Partner with vendors and equipment engineers to keep tools in good health and ready-to-use state
Supporting statistical process control (SPC), continuous improvement efforts, and the management and dissemination of metrology and defect metrology data
Qualification
Required
Bachelor's degree in Electrical Engineering, Chemical Engineering, Materials Engineering and Mechanical Engineering, Chemistry, Physics or other related technical discipline with 6 months+ of relevant experience
General understanding of defect inspection and review tools (such as dark field, bright field, and scanning electron microscopes)
General understanding of metrology (such as CD SEMs. litho overlay tools, surface topology profilers, thin film thickness measurement tools) or analytical tools
Basic knowledge of statistical process control
Hands on experience with Si, GaAs, or other wafers
Ability to work in a cleanroom setting
Ability to work 2nd shift hours (3PM-12AM Mon-Fri) and work either 5x8 or 9/80B schedule
U.S. Citizenship and the ability to obtain and maintain a DoD Secret clearance is required
Bachelor's degree in Electrical Engineering, Chemical Engineering, Materials Engineering and Mechanical Engineering, Chemistry, Physics or other related technical discipline with 2 years of relevant experience
General understanding of defect inspection and review tools (such as dark field, bright field, and scanning electron microscopes)
General understanding of metrology (such as CD SEMs. litho overlay tools, surface topology profilers, thin film thickness measurement tools) or analytical tools
Basic knowledge of statistical process control
Hands on experience with Si, GaAs, or other wafers
Ability to work in a cleanroom setting
Ability to work 2nd shift hours (3PM-12AM Mon-Fri) and work either 5x8 or 9/80B schedule
U.S. Citizenship and the ability to obtain and maintain a DoD Secret clearance is required
Preferred
Hands on knowledge and operation of defect inspection and review tools (such as dark field, bright field, and scanning electron microscopes)
Hands on knowledge and operation of metrology (such as CD SEMs, litho overlay tools, surface topology profilers, thin film thickness measurement tools) or analytical tools
Experience in lean manufacturing practices and structured problem-solving methodology
Experience working in a cleanroom setting
1 year experience with semiconductor fabrication
Data analysis and visualization (JMP)
Experience developing technical specifications for equipment procurement
Active Secret clearance
Benefits
Health insurance coverage
Life and disability insurance
Savings plan
Company paid holidays
Paid time off (PTO) for vacation and/or personal business
Company
Northrop Grumman
Northrop Grumman is an aerospace, defense and security company that provides training and satellite ground network communications software.
10001+ employees
Funding
Current Stage
Public CompanyTotal Funding
$3.7BKey Investors
U.S. Department of DefenseNASA
2025-05-27Post Ipo Debt· $1B
2024-01-29Post Ipo Debt· $2.5B
2023-12-20Grant· $72M
Leadership Team
Tom Wilson
Corporate Vice President, Enterprise Business Development
Jeffrey Worsham
Chief Product Owner - Advanced Technology Development
Recent News
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