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Snap Inc. · 2 months ago

PCB Design Engineer, Level 6

Palo Alto, California

Full-time

Onsite

Senior Level

$276K/yr - $414K/yr

7+ years exp

Snap Inc. is a technology company that empowers people to express themselves and communicate through innovative products. They are seeking a Senior PCB Designer to work closely with engineering teams to produce high-density PCB designs from prototype to mass production, ensuring quality and compliance throughout the design process.

Computer Software

Comp. & Benefits

H1B Sponsor Likely

Responsibilities

Work closely with electrical, mechanical, and manufacturing engineers to produce industry leading flexes and printed circuit board (PCB) designs from prototype through mass production using Allegro PCB Designer

Design high density PCBs, flexes, and rigid flexes requiring the use of stacked microvias, sequential lamination stack-ups, and fine pitch packages

Create fabrication and assembly drawings

Define design rules, apply them to the constraint manager, design within limits, create artworks, fabrication and assembly documentation, and verify designs prior to release

Collaborate with suppliers on stackups, capabilities, and solving engineering issues

Manage external ECAD resources as needed

Review Gerber/ODB++ data to ensure quality of design release

Drive simultaneous development of multiple challenging, complex PCB designs to meet critical program deadlines

Qualification

PCB Layout CAD toolsHigh density PCB designFlex & Rigid Flex DesignsIPC standardsDesign for ManufacturabilityDesign for AssemblyDesign for TestabilityCommunication skillsAttention to detailProblem-solving skillsCollaboration skills

Required

BS/BA degree, related field, or equivalent years of experience

7+ years of experience using PCB Layout CAD tools to design high density, highly constrained HDI boards with fine pitch (<0.5mm) BGAs

10+ years of post-Bachelor's in Electrical Engineering experience in; PCB Layout CAD tools to design high density, highly constrained HDI boards with fine pitch (<0.5mm) BGAs, or Master's degree in a technical field + 9+ years of post-grad experience; or PhD in a relevant technical field + 6+ years of post-grad experience

Ability to communicate effectively in both oral and written form

Ability to understand and follow instructions

Skill in using logic and reasoning to identify the strengths and weaknesses of alternative solutions, conclusions, or approaches to problems

Skill in completing assignments accurately and with attention to detail

Ability to work under pressure and meet close deadlines

Ability to analyze, organize and prioritize work while meeting multiple deadlines

Ability to collaborate and operate in a fast-paced cross-functional environment including engineering teams, vendors, suppliers, and outside resource management

Preferred

Experience developing consumer electronic devices at production scale

Experience routing impedance controlled nets, including differential pairs, per engineer's instructions and component specifications

Strong skills in designing quality multi-layer, high density designs with careful consideration of analog, RF, high speed, and/or power circuits

Demonstrated understanding of IPC, Design for Manufacturability (DFM), Design for Assembly (DFA), and Design for Testability (DFT)

Knowledge of PCB design standards for common interfaces in consumer products such as USB, PCIE, CSI, MIPI, and WIFI

Experience with best practices for system integration and layout verification including mating of multiple boards (pin 1 verification methods, system level high speed length matching) and mechanical interference checks

Experience with one or more of the following: Flex & Rigid Flex Designs, Cadence Allegro, ORCAD Capture, CIS/CIP, CAM350, and/or Valor toolsets, PCB ECAD Library creation and management, and/or script/automation creation

Benefits

Paid parental leave

Comprehensive medical coverage

Emotional and mental health support programs

Compensation packages that let you share in Snap’s long-term success

This position is eligible for equity in the form of RSUs.

Company

Snap Inc.

Glassdoor3.6

Snap is a technology company. We believe the camera presents the greatest opportunity to improve the way people live and communicate.

Founded in 2011

Santa Monica, California, US

5001-10000 employees

https://careers.snap.com/

H1B Sponsorship

Snap Inc. has a track record of offering H1B sponsorships. Please note that this does not guarantee sponsorship for this specific role. Below presents additional info for your reference. (Data Powered by US Department of Labor)

Distribution of Different Job Fields Receiving Sponsorship

Represents job field similar to this job

Trends of Total Sponsorships

2025 (394)

2024 (366)

2023 (332)

2022 (356)

2021 (318)

2020 (237)