Analog IC Design Engineering Intern (RF Design) jobs in United States
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Texas Instruments · 2 months ago

Analog IC Design Engineering Intern (RF Design)

positionEXKI 13560 N. Central Expwy, Dallas, TX, 75243, US
timeInternship
remoteOnsite
seniorityIntern

Texas Instruments is a leading company in semiconductor design and manufacturing, and they are seeking an RF Design Intern within Kilby Labs. The role involves designing high frequency advanced package interconnects and developing thermal and mechanical models using FEM simulators.

ComputerDSPSemiconductor
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Growth Opportunities
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H1B Sponsor Likelynote

Responsibilities

Design of high frequency advanced package interconnects using FEM simulators
Analyzing the measurement results of high frequency package interconnects (i.e. CuPillars, solder bumps), study of de-embedding and correlation with simulation results
Development of a thermal model for high power advanced packages using FEM solvers
Development of a mechanical model for advanced package structures using FEM solvers

Qualification

FEM simulationRF designThermal modelingMechanical modelingData analysis

Required

Master's Degree
Experience with FEM simulators
Knowledge of high frequency package interconnects
Ability to analyze measurement results of high frequency package interconnects
Experience with thermal modeling using FEM solvers
Experience with mechanical modeling for advanced package structures using FEM solvers

Company

Texas Instruments

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Texas Instruments is a global semiconductor company that manufactures, designs, tests, and sells embedded and analog processing chips.
dateFounded in 1930
location
Dallas, Texas, USA
people-size10001+ employees
web-link
http://www.ti.com

H1B Sponsorship

Texas Instruments has a track record of offering H1B sponsorships. Please note that this does not guarantee sponsorship for this specific role. Below presents additional info for your reference. (Data Powered by US Department of Labor)
Distribution of Different Job Fields Receiving Sponsorship
Represents job field similar to this job
Trends of Total Sponsorships
2025 (189)
2024 (184)
2023 (148)
2022 (222)
2021 (165)
2020 (179)

Funding

Current Stage
Public Company
Total Funding
$13.61B
Key Investors
U.S. Department of Commerce
2025-05-20Post Ipo Debt· $1.2B
2024-12-20Grant· $1.61B
2024-05-28Post Ipo Equity· $2.5B

Leadership Team

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Richard Templeton
President and Chief Executive Officer
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Krunali Patel
Senior vice president and chief information officer
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