Analog IC Design Engineering Intern (RF Design) jobs in United States
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Texas Instruments · 3 weeks ago

Analog IC Design Engineering Intern (RF Design)

Texas Instruments is a global semiconductor company that designs, manufactures, and sells analog and embedded processing chips. The RF Design Intern role involves designing high frequency advanced package interconnects and developing thermal and mechanical models for advanced packages.

ComputerDSPSemiconductor
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Growth Opportunities
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H1B Sponsor Likelynote

Responsibilities

Design of high frequency advanced package interconnects using FEM simulators
Analyzing the measurement results of high frequency package interconnects (i.e. CuPillars, solder bumps), study of de-embedding and correlation with simulation results
Development of a thermal model for high power advanced packages using FEM solvers
Development of a mechanical model for advanced package structures using FEM solvers

Qualification

RF Power Amplifier designRF/mmWave IC designHigh frequency electromagnetic solversThermal models using FEM solversMechanical models using FEM solversHigh frequency passive component designRF measurementsElectrical Engineering

Required

Currently pursuing Masters or PhD degree in Electrical Engineering or related field with RF Power Amplifier design background and RF/mmWave IC design experience
Cumulative 3.0/4.0 GPA or higher

Preferred

Experience with high frequency electromagnetic solvers
Experience with thermal and mechanical models using FEM solvers
Understanding the high frequency passive component design
Knowledge of RF measurements and de-embedding

Benefits

Competitive pay and benefits designed to help you and your family live your best life

Company

Texas Instruments

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Texas Instruments is a global semiconductor company that manufactures, designs, tests, and sells embedded and analog processing chips.

H1B Sponsorship

Texas Instruments has a track record of offering H1B sponsorships. Please note that this does not guarantee sponsorship for this specific role. Below presents additional info for your reference. (Data Powered by US Department of Labor)
Distribution of Different Job Fields Receiving Sponsorship
Represents job field similar to this job
Trends of Total Sponsorships
2025 (189)
2024 (184)
2023 (148)
2022 (222)
2021 (165)
2020 (179)

Funding

Current Stage
Public Company
Total Funding
$13.61B
Key Investors
U.S. Department of Commerce
2025-05-20Post Ipo Debt· $1.2B
2024-12-20Grant· $1.61B
2024-05-28Post Ipo Equity· $2.5B

Leadership Team

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Richard Templeton
President and Chief Executive Officer
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Krunali Patel
Senior vice president and chief information officer
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Company data provided by crunchbase