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Qualcomm · 5 months ago

Thermal Architect

Santa Clara, California, United States of America

Full-time

Onsite

Senior Level

$220K/yr - $330K/yr

6+ years exp

Qualcomm Technologies, Inc. is focused on developing high-performance, energy-efficient server solutions for data center applications. The Thermal Architect will define and drive thermal strategies for server platforms, working closely with cross-functional teams to ensure robust thermal performance from concept through validation and production.

Artificial Intelligence (AI)Generative AISoftwareTelecommunicationsWireless

Comp. & Benefits

H1B Sponsor Likely

Responsibilities

Lead system-level thermal architecture, modeling, and optimization for complex server platforms

Drive end-to-end thermal design—from concept and analysis to validation and manufacturing readiness

Coordinate planning, schedules, and deliverables across thermal, mechanical, and system teams

Provide technical direction and mentorship, promoting best practices in thermal design and validation

Correlate simulations with hardware data to improve model accuracy and design robustness

Explore and integrate advanced thermal materials and cooling technologies for high-power electronics

Prepare clear documentation, reports, and presentations for internal and external stakeholders

Qualification

Thermal modelingHeat transferCFD toolsCross-functional coordinationTechnical documentationProgramming experienceCAD proficiencyCommunicationMentorship

Required

Master's degree in Mechanical Engineering, Engineering Mechanics, Materials Science, or a related field

8+ years of experience in thermal modeling and system-level design within the high-tech or data center industry

Strong foundation in heat transfer (conduction, convection, radiation)

Proficiency with CFD tools (e.g., Celsius EC, Flotherm, Icepak) and thermal testing techniques

Experience coordinating cross-functional deliverables and influencing system-level design

Excellent communication and technical documentation skills

Preferred

Ph.D. in Mechanical Engineering, Engineering Mechanics, Materials Science, or a related field

12+ years of thermal design experience for high-performance computing or server systems

Familiarity with OCP designs and industry thermal standards

Expertise in simulation-to-test correlation and thermal validation

Programming experience (e.g., Python, MATLAB, C/C++) for analysis automation

CAD proficiency (e.g., SolidWorks, Creo)

Benefits

Competitive annual discretionary bonus program

Opportunity for annual RSU grants

Highly competitive benefits package designed to support your success at work, at home, and at play

Company

Qualcomm

Glassdoor4.0

Qualcomm designs wireless technologies and semiconductors that power connectivity, communication, and smart devices.

Founded in 1985

San Diego, California, USA

10001+ employees

http://www.qualcomm.com

H1B Sponsorship

Qualcomm has a track record of offering H1B sponsorships. Please note that this does not guarantee sponsorship for this specific role. Below presents additional info for your reference. (Data Powered by US Department of Labor)

Distribution of Different Job Fields Receiving Sponsorship

Represents job field similar to this job

Trends of Total Sponsorships

2025 (2013)

2024 (1910)

2023 (3216)

2022 (2885)

2021 (2104)

2020 (1181)

Funding

Current Stage

Public Company

Total Funding

$3.5M

1991-12-20IPO

1988-01-01Undisclosed· $3.5M

Leadership Team

Cristiano Amon

President & CEO

Isaac Eteminan

CEO

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Company data provided by crunchbase