SBU Product Line Management IV - (E4) jobs in United States
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Applied Materials · 23 hours ago

SBU Product Line Management IV - (E4)

Applied Materials is a global leader in materials engineering solutions used in the semiconductor industry. The SBU Product Line Management IV role involves managing service product development, engaging in new product design, and leading projects to enhance service capabilities and performance improvements.

ElectronicsManufacturingSemiconductorSoftware
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H1B Sponsor Likelynote

Responsibilities

Technical Program Manage service product development from Initiation to Release
Initiation (PG1): Lead HVP (High Value Problem) discovery through VOC (Voice of Customer) & FSO. Propose and select appropriate solutions based on ROI estimates. Lead team to assess Market Opportunity and select beta sites
Validation (PG3): Chair regular Core Team meetings to drive design & development of proposed solutions through internal SBU sensor development or cross-functional teams (OCE, DT/AIx, FV, BU). Be accountable for successful beta demonstration by working with FSO, FSO Focals, AGS Focals responsible for the beta site
Release (PG5): Drive creation of Marketing Collateral to train sales and BD on new Service Product; Field Training (AGU courses) and Procedures for CE’s, PSE’s that will support the Contract enabled by the Service Product. Report on actual Service revenue generated by the new Service Product vs. what was forecast
MPR (Monthly Product Reviews): provide status updates and help needed to AGS executives throughout the Phase Gate release cycle
Closely work with Equipment BU NPI PDP teams and Field Service teams to concurrently develop AGS service products in step with BU NPI product release
Work with Business Unit on their NPIs (New Product Introductions) to prepare and embed service product offerings
Spearhead AIx growth engine to develop new capability and enable service product offers
Define/approve Product application support plans for service product offers
Make sure Products meet all requirements; CoO, MTTR, MTBC, SDUT, etc…
Work with team on AGS DfI, DfS, etc…
Training: AGS-TS, FSO, SBU FSO Team, TSE, PSE, Digital Tool Team, FabVantage Team, etc
Perform analysis, summaries, as well as develop and transfer package of new applications / platforms to product division and customer support team
Spares, Training, AIx, etc
Create & Lead new methodologies in order to optimized system performance for specific application
Digital Tool new development, adjust existing Digital Tools to current application / platform, etc
Leads the Core Teams on NPI evaluation and demos at customers site, through CIF (Common Interests Framework), high involvement in the SOW and commitment schedule
Interfaces with BU, FSO / PSE, and customer teams regarding technical requirements, analysis, schedule, deliverables, and closure
Lead customer Technical Review Meetings and deliverable measurables

Qualification

Dielectric DepositionAtomic Layer DepositionProcess EngineeringTechnical Program ManagementMicrosoft Office SuiteCommunication SkillsProblem SolvingLeadership

Required

Strong technical knowledge, preferably with Dielectric Deposition / Atomic Layer Deposition semiconductor equipment in the areas of process engineering and optimization, customer fab operations, hardware design, as well as business acumen
Over five years of process and hardware experience on DCVD semiconductor equipment
Passion for technical program management
Strong communication skills
3-5 years of DDP BU / Application / Platform experience
Program Management proficiency
Skilled at Microsoft Office suite; esp. PowerPoint, Excel
Ability to create material and present it to executives / large groups
Semi-space awareness; Regions, customer, segments
Knowledge of best practices, integrate AGS and BU best practices into common spaces; aware of the competition (AGS and BU) and the factors that differentiate them in the market
Ability to drive cross-functional teams; lead projects with notable risk and complexity; develop the strategy for project execution
Ability to coach and mentor colleagues with less experience
Ability to solve unique and complex problems with broad impact on the business; requires conceptual and innovative thinking to develop solutions
Self-driving; able to negotiate progress around roadblocks; willing to ask for help and find support for developing solutions
Ability to impact the direction and resource allocation for program, project or services; works within general functional policies and industry
Ability to communicate difficult concepts and negotiate with others to adopt a different point of view

Benefits

Comprehensive benefits package
Participation in a bonus and a stock award program

Company

Applied Materials

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Applied Materials is a semiconductor and display equipment company that offers materials engineering solutions.

H1B Sponsorship

Applied Materials has a track record of offering H1B sponsorships. Please note that this does not guarantee sponsorship for this specific role. Below presents additional info for your reference. (Data Powered by US Department of Labor)
Distribution of Different Job Fields Receiving Sponsorship
Represents job field similar to this job
Trends of Total Sponsorships
2025 (435)
2024 (465)
2023 (362)
2022 (429)
2021 (456)
2020 (354)

Funding

Current Stage
Public Company
Total Funding
$2.1B
Key Investors
Stonnington GroupUS Department of Energy
2025-02-24Post Ipo Debt· $2B
2023-06-27Post Ipo Equity· $0.38M
2022-10-19Grant· $100M

Leadership Team

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Omkaram Nalamasu
Senior Vice President and Chief Technology Officer
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Tony Chiang, Ph.D
VP, CTO Applied AI
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Company data provided by crunchbase