ElectroMechanical Packaging Engineer II jobs in United States
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Lockheed Martin · 1 month ago

ElectroMechanical Packaging Engineer II

Lockheed Martin is a leading technology innovation company seeking an experienced Electronics Packaging Engineer to join their Fleet Ballistic Missile Avionics team. The role involves developing preliminary 3D concept models of space flight avionics hardware and working closely with senior engineers to ensure compliant designs through various analyses and support manufacturing processes.

AerospaceCyber SecurityMachinery ManufacturingMilitaryNational SecurityRemote SensingSecurity
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Growth Opportunities
badNo H1BnoteSecurity Clearance RequirednoteU.S. Citizen Onlynote

Responsibilities

Support trade studies on cable and harness design approaches and will provide technical data for informal and formal design review documentation and presentations
Coordinate with thermal, dynamic, stress, reliability, EMC, and survivability analyses to assure compliant designs
Support manufacturing and test disciplines in minimizing cycle time and resolving problems
Establish specifications for contract assemblers and raw-material vendors
Interface with Parts Engineering, Quality Assurance and Purchasing regarding material quality and vendor performance
Provide producible designs that meet technical, cost, and schedule requirements, and work within an Integrated Product Team environment
Prepare all applicable drawings and documentation needed for the fabrication and assembly of the hardware designed
Identify initial physical architecture for the Avionics subsystem
Conduct R&D trade studies for Pre-SRR design phase
Define the requirements and provide the framework for architecture and interface development & maintenance throughout the program lifecycle
Generate and release design disclosure artifacts including technical presentations and end of year reports
Work on a cross-functional team in the development and integration of world class avionics systems
Develop electronic enclosure designs, performance and test requirements, and stress and thermal analysis
Participate in iterative design reviews, Engineering Material Review Board (EMRB) hardware discrepancy decisions and Failure Review Board (FRB) as required
Resolve test anomalies and support system level testing

Qualification

Electronics Packaging EngineeringGeometric DimensioningTolerancingCAD modeling CREOCAD modeling SolidWorksDFx PrinciplesMissile/Aerospace experienceMicrosoft Office proficiencyCable manufacturing processesHands-on hardware experienceCommunication skillsTeam collaboration

Required

Bachelor of Science or higher from an accredited college in Mechanical or Aerospace Engineering or related discipline, or equivalent experience/combined education
1+ years professional experience
Full working knowledge and experience with Geometric Dimensioning and Tolerancing (GD&T)
CAD modeling and drafting experience (CREO, SolidWorks and/or similar CAD data modeling experience, model based engineering)
Willing and able to obtain and maintain a DoD Top-Secret clearance, thus US Citizenship is required

Preferred

Working knowledge EPDM tools or equivalent
Exposure to DFx Principles (Design for Affordability, Design for Manufacturability, etc.)
Experience with CREO CAD modeling and Zuken
Missile/Aerospace related experience
Proficiency in Microsoft Office Software (Word, Excel, MS Project, PowerPoint)
Familiarity with FBM specifications/procedures
Familiarity and experience partnering with SP/SPF Customer Partners
Experience with QNotes (SAP/ERP), PMP Database, FAST Items, DaSI, and FBM Web (Livelink)
Previous CPE and MRB experience
Ability to communicate issues and additional resource needs to leadership
Experience with subcontracted hardware suppliers
Knowledge of cable manufacturing processes (connectors, crimping, soldering, forming, testing)
Experience performing tolerance stack-ups
Exposure to Requalification Activities including MORAs and Supplier Relocations
Demonstrated ability to collaborate effectively within a team environment and with adjacent disciplines
Excellent communication, presentation and interpersonal skills with technical and non-technical audiences including design reviews (SRR, PDR, CDR, etc.)
Hands-on hardware experience

Benefits

Medical
Dental
Vision
Life Insurance
Short-Term Disability
Long-Term Disability
401(k) match
Flexible Spending Accounts
EAP
Education Assistance
Parental Leave
Paid time off
Holidays

Company

Lockheed Martin

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Lockheed Martin is a global security and aerospace company that specializes in advanced technology systems, products, and services. It is a sub-organization of Lockheed Martin.

Funding

Current Stage
Public Company
Total Funding
$6.06B
Key Investors
Air Force Research Laboratory
2025-12-05Post Ipo Debt· $3B
2025-08-28Post Ipo Debt· $3B
2023-11-13Grant· $33.7M

Leadership Team

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Jim Taiclet
Chairman, President & CEO
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Craig Martell
Chief Technology Officer
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Company data provided by crunchbase