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Lockheed Martin · 1 month ago

ElectroMechanical Packaging Engineer III

Englewood, CO

Full-time

Onsite

Mid Level

3+ years exp

Lockheed Martin is seeking an experienced Electronics Packaging Engineer to work on the Fleet Ballistic Missile Avionics team. The role involves developing 3D concept models of space flight avionics hardware and supporting various engineering analyses to ensure compliant designs for flight use.

AerospaceCyber SecurityMachinery ManufacturingMilitaryNational SecurityRemote SensingSecurity

Growth Opportunities

No H1B

Security Clearance Required

U.S. Citizen Only

Responsibilities

Support trade studies on electronic enclosure design approaches and will provide technical data for informal and formal design review documentation and presentations

Coordinate with thermal, dynamic, stress, reliability, EMC, and survivability analyses to assure compliant designs

Support manufacturing and test disciplines in minimizing cycle time and resolving electronic packaging problems

Establish specifications for contract assemblers and raw-material vendors

Interface with Parts Engineering, Quality Assurance and Purchasing regarding material quality and vendor performance

Provide producible designs that meet technical, cost, and schedule requirements, and work within an Integrated Product Team environment

Prepare all applicable drawings and documentation needed for the fabrication and assembly of the hardware designed

Identify initial physical architecture for the Avionics subsystem

Assist with R&D trade studies for Pre-SRR design phase

Assist with defining the requirements and provide the framework for architecture and interface development & maintenance throughout the program lifecycle

Generate and release design disclosure artifacts including technical presentations and end of year reports

Work on a cross-functional team in the development and integration of world class avionics systems

Develop electronic enclosure designs, performance and test requirements, and stress and thermal analysis

Participate in iterative design reviews, Engineering Material Review Board (EMRB) hardware discrepancy decisions and Failure Review Board (FRB) as required

Resolve test anomalies and support system level testing

Qualification

Electronic enclosure designStress analysisThermal analysis3D modelingProblem resolutionTechnical presentationsCross-functional teamwork

Required

Experience with electronic enclosure designs, performance and test requirements, and stress and thermal analysis

3+ years professional experience

US Citizenship is required

Benefits

Comprehensive Benefits Package

Company

Lockheed Martin

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Lockheed Martin is a global security and aerospace company that specializes in advanced technology systems, products, and services. It is a sub-organization of Lockheed Martin.

Founded in 1912

Bethesda, Maryland, USA

10001+ employees