ElectroMechanical Packaging Engineer II jobs in United States
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Lockheed Martin · 1 month ago

ElectroMechanical Packaging Engineer II

Lockheed Martin is a leader in aerospace and defense, seeking an experienced ElectroMechanical Packaging Engineer II to join their Fleet Ballistic Missile Avionics team. The role involves developing 3D concept models for space flight avionics hardware and collaborating with senior engineers to ensure compliant designs through various analyses and support activities.

AerospaceCyber SecurityMachinery ManufacturingMilitaryNational SecurityRemote SensingSecurity
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Growth Opportunities
badNo H1BnoteSecurity Clearance RequirednoteU.S. Citizen Onlynote

Responsibilities

Support trade studies on cable and harness design approaches and will provide technical data for informal and formal design review documentation and presentations
Coordinate with thermal, dynamic, stress, reliability, EMC, and survivability analyses to assure compliant designs
Support manufacturing and test disciplines in minimizing cycle time and resolving problems
Establish specifications for contract assemblers and raw-material vendors
Interface with Parts Engineering, Quality Assurance and Purchasing regarding material quality and vendor performance
Provide producible designs that meet technical, cost, and schedule requirements, and work within an Integrated Product Team environment
Prepare all applicable drawings and documentation needed for the fabrication and assembly of the hardware designed
Identify initial physical architecture for the Avionics subsystem
Conduct R&D trade studies for Pre-SRR design phase
Define the requirements and provide the framework for architecture and interface development & maintenance throughout the program lifecycle
Generate and release design disclosure artifacts including technical presentations and end of year reports
Work on a cross-functional team in the development and integration of world class avionics systems
Develop electronic enclosure designs, performance and test requirements, and stress and thermal analysis
Participate in iterative design reviews, Engineering Material Review Board (EMRB) hardware discrepancy decisions and Failure Review Board (FRB) as required
Resolve test anomalies and support system level testing

Qualification

Electronics Packaging3D ModelingThermal AnalysisStress AnalysisEMC ComplianceTeam CollaborationTechnical DocumentationProblem Solving

Required

1+ years professional experience
US Citizenship is required

Benefits

Lockheed Martin’s Comprehensive Benefits Package

Company

Lockheed Martin

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Lockheed Martin is a global security and aerospace company that specializes in advanced technology systems, products, and services. It is a sub-organization of Lockheed Martin.

Funding

Current Stage
Public Company
Total Funding
$6.06B
Key Investors
Air Force Research Laboratory
2025-12-05Post Ipo Debt· $3B
2025-08-28Post Ipo Debt· $3B
2023-11-13Grant· $33.7M

Leadership Team

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Jim Taiclet
Chairman, President & CEO
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Craig Martell
Chief Technology Officer
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Company data provided by crunchbase