Principal IO Design Architect, HBM jobs in United States
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Micron Technology · 2 months ago

Principal IO Design Architect, HBM

Micron Technology is a world leader in innovating memory and storage solutions. They are seeking a Principal HBM IO Architecture Design engineer to own the development of the PHY IO on the interface die in HBM products, collaborating with a multi-functional team to ensure the success of their HBM roadmap.

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H1B Sponsor Likelynote

Responsibilities

IO and datapath design architect for HBM products
Design low-power high-speed Tx, Rx, clock tree
Analyze timing jitter and variation to improve speed and optimize design
Contribute to cross group communication to work towards standardization and group success
Proactively solicit guidance from Standards, CAD, modeling, and verification groups to ensure the design quality
Drive innovation into the future Memory generation with multifaceted work environment

Qualification

High-speed clocking designIO circuit designCircuit verificationOff-chip protocolsFinFET device characteristicsDevice physics understandingCircuit debug experienceIP level verificationProblem-solving skillsCommunication skills

Required

Prior industrial experience in high-speed clocking design at 16Gbps+ speed
Good IO circuit design background with familiarity of both, analog and digital design and simulation experience required
Solid knowledge of IO design principles for practical design tradeoffs on speed/area/power/complexity
Experience with circuit verification and optimization including layout verification and parasitic extractions of the circuits
Familiar with one or more off-chip protocols such as UCIe, HBM, DDR, PCIe, MIPI, etc
Good understanding on FinFET device characteristics and hands-on design experience
Excellent problem-solving and analytical skills
Strong communication skills with the ability to clearly convey sophisticated technical concepts to other design peers both verbally and written
Minimum 5+ years of proven experience in the Memory industry with an MS EE degree, or 7+ years with a BS EE or equivalent experience

Preferred

Understanding of device physics and basic CMOS processing techniques preferred
Prior circuit debug experience through Product Engineering or equivalent preferred
D2D design experience is a plus
Familiar with IP level verification and strong RTL debugging capabilities is a plus

Benefits

Choice of medical, dental and vision plans
Benefit programs that help protect your income if you are unable to work due to illness or injury
Paid family leave
Robust paid time-off program
Paid holidays

Company

Micron Technology

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Micron Technology is a semiconductor company that produces DRAM, SDRAM, flash memory, SSD and CMOS image sensing chips.

H1B Sponsorship

Micron Technology has a track record of offering H1B sponsorships. Please note that this does not guarantee sponsorship for this specific role. Below presents additional info for your reference. (Data Powered by US Department of Labor)
Distribution of Different Job Fields Receiving Sponsorship
Represents job field similar to this job
Trends of Total Sponsorships
2025 (573)
2024 (429)
2023 (299)
2022 (626)
2021 (564)
2020 (538)

Funding

Current Stage
Public Company
Total Funding
$8.9B
Key Investors
U.S. Department of Commerce
2025-04-24Post Ipo Debt· $1.75B
2025-01-16Post Ipo Debt· $1B
2024-04-18Grant· $6.1B

Leadership Team

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Sanjay Mehrotra
Chairman, President & CEO
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Gursharan Singh
Senior Vice President BE Operations
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Company data provided by crunchbase