Physical Design Lead – Custom Silicon Management jobs in United States
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Apple · 5 months ago

Physical Design Lead – Custom Silicon Management

Apple is a leading technology company known for its innovative products. They are seeking a Physical Design Lead to drive technical engagements between Apple and silicon suppliers, focusing on the design and development of custom silicon for mobile products. The role involves auditing vendor processes, ensuring high-quality chip designs, and collaborating with various teams to meet design goals.

AppsArtificial Intelligence (AI)BroadcastingDigital EntertainmentFoundational AIMedia and EntertainmentMobile DevicesOperating SystemsTVWearables
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Comp. & Benefits
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H1B Sponsor Likelynote

Responsibilities

Audit vendor PD flows and methodologies for any holes and set up issues
Suggest improvements to their methodology to optimize it to obtain the best QoR for Apple chips
Work closely with the internal teams like systems and program management to ensure that the vendor PD implementation team is meeting the design goals
Work closely with specialists from other teams like the packaging, process etc. to resolve any issues in the project which are in an area closely related to PD
Conduct periodic design reviews - with deep technical dives - to make sure the project is tracking to the schedule and maintaining a high quality of work
Review all the final PD, STA, SI, Electrical analysis reports and sign-off on them for tapeout approval
Provide post tapeout support to work on ECOs and debug, if required
Adhere to a strict and consistent standard of operation across all vendors and projects
Maintain a professional relationship with the vendor and yet walk the fine line to maintain the customer-vendor distance

Qualification

Physical Design experienceLeading physical design teamsP&R methodology knowledgeStatic Timing AnalysisPowerSignal IntegrityIndustry CAD toolsDigital design conceptsLow power techniquesDebugging LVSDRC issuesAnalog layout design practicesMixed signal SoC tapeoutsIP extractionCharacterization

Required

BS degree
Physical Design experience
Knowledge of digital design concepts

Preferred

10+ years of relevant industry experience
Experience leading physical design teams
Track record of having taped out a number of complex chips - from gates to GDS
Working knowledge of front-end design methodology including basic RTL coding, synthesis methodology, timing constraints generation, multiple clock domain handling, low power techniques
In depth practical, hands-on knowledge of the entire P&R methodology - including but not limited to - IO planning, ESD techniques, floor planning, power planning, clock tree synthesis, MCMM timing closure, routing, DFM techniques and physical verification
Working knowledge of at least one of the industry CAD tools - Cadence, Synopsys, Mentor or Atoptech
Proficient in Static Timing Analysis and the techniques used for timing closure and noise avoidance / fixing
Hands-on experience in Power and Signal Integrity analysis
Ability to debug and fix LVS, DRC, Antenna, ERC issues
Familiarity with the best analog layout design practices for sensitive circuits like OpAmp, matching pair, etc
Mixed signal SoC tapeouts involving multiple instances of analog IPs
Low power / leakage management methodology and techniques
Extraction and characterization of IP elements

Benefits

Comprehensive medical and dental coverage
Retirement benefits
A range of discounted products and free services
Reimbursement for certain educational expenses — including tuition
Discretionary bonuses or commission payments
Relocation

Company

Apple is a technology company that designs, manufactures, and markets consumer electronics, personal computers, and software.

H1B Sponsorship

Apple has a track record of offering H1B sponsorships. Please note that this does not guarantee sponsorship for this specific role. Below presents additional info for your reference. (Data Powered by US Department of Labor)
Distribution of Different Job Fields Receiving Sponsorship
Represents job field similar to this job
Trends of Total Sponsorships
2025 (6998)
2024 (3766)
2023 (3939)
2022 (4822)
2021 (4060)
2020 (3656)

Funding

Current Stage
Public Company
Total Funding
$5.67B
Key Investors
Berkshire HathawayMicrosoftSequoia Capital
2025-05-05Post Ipo Debt· $4.5B
2025-01-16Post Ipo Debt· $0.31M
2021-04-30Post Ipo Equity

Leadership Team

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Tim Cook
CEO
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Craig Federighi
SVP, Software Engineering
Company data provided by crunchbase