IC Power, IR and EM Sr. Application Engineer jobs in United States
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Cadence · 1 week ago

IC Power, IR and EM Sr. Application Engineer

Cadence is a company that hires and develops leaders and innovators in technology. They are seeking a Senior Application Engineer to solve complex challenges in chip power integrity and thermal analysis, focusing on delivering high-quality solutions to customers.

AerospaceElectronic Design Automation (EDA)HardwareMobileSemiconductorSoftware
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Growth Opportunities
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H1B Sponsor Likelynote

Responsibilities

Strong ability to solve electrical and electronic circuits
Excellent knowledge on how power, IR, and EM analyses impact chip planning to IR/EM sign-off
Fundamental understanding of interconnect modeling, package analysis, and die modeling
Ability to write and debug automation code in Python or Tcl
Solid grasp on foundational algorithms to solve numerical and graph problems
Basic idea on how EDA and Semiconductor industry eco-system works
Alacrity to be an excellent team player

Qualification

Power Integrity analysisIR/EM sign-offInterconnect modelingPython programmingTcl programmingNumerical algorithmsTeam collaboration

Required

Strong ability to solve electrical and electronic circuits
Excellent knowledge on how power, IR, and EM analyses impact chip planning to IR/EM sign-off
Fundamental understanding of interconnect modeling, package analysis, and die modeling
Ability to write and debug automation code in Python or Tcl
Solid grasp on foundational algorithms to solve numerical and graph problems
Basic idea on how EDA and Semiconductor industry eco-system works
Alacrity to be an excellent team player

Benefits

Paid vacation and paid holidays
401(k) plan with employer match
Employee stock purchase plan
A variety of medical, dental and vision plan options
And more

Company

Cadence is a market leader in AI and digital twins, pioneering the application of computational software to accelerate innovation in the engineering design of silicon to systems.

H1B Sponsorship

Cadence has a track record of offering H1B sponsorships. Please note that this does not guarantee sponsorship for this specific role. Below presents additional info for your reference. (Data Powered by US Department of Labor)
Distribution of Different Job Fields Receiving Sponsorship
Represents job field similar to this job
Trends of Total Sponsorships
2025 (306)
2024 (221)
2023 (282)
2022 (330)
2021 (233)
2020 (209)

Funding

Current Stage
Public Company
Total Funding
unknown
1998-02-20IPO

Leadership Team

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Paul Cunningham
Senior Vice President and General Manager
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Tom Beckley
Senior Vice President, Custom IC & PCB Group
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Company data provided by crunchbase