Celestica · 6 hours ago
Senior Lead Thermal Engineer, Hardware Design
Richardson, TX
Full-time
Onsite
Senior Level, Lead/Staff
$96K/yr - $143K/yrCelestica is a leader in hardware solutions, specializing in designing and manufacturing cutting-edge technology. The Senior Lead Thermal Engineer will be responsible for creating high-end electronics cooling solutions and collaborating with various teams to define and develop best-in-class products.
ElectronicsManufacturingProduct DesignSupply Chain Management
Responsibilities
Complete ownership of thermal design for various electronic products from thermal modeling, design, test, and design revision, until transfer to manufacturing
Conduct thermal simulations, postprocessing, and analysis ranging from chip to facilities level to verify thermal feasibility, risk, and to inform your designs
Maintain awareness of heat transfer hardware available from all sources, including how it operates and performs, its cost, and how it can be incorporated into our products
Conceive and implement ways to enhance and extend operation of heat transfer hardware
Consider the thermal aspects of chip packaging technologies
Apply best-in-class fluid flow geometry and technology to cool high heat flux chips
Determine and consider the effects of contact resistance and the use of Thermal Interface Materials
Apply air cooling when possible and liquid cooling when necessary to achieve full performance and reliability at the lowest cost
Size liquid cold plates, heat sinks, heat pipes, air movers, air filters, air ducting, and perforated plates
Plan your work to achieve full required performance, and stay on schedule to support overall product development
Reference real world limitations to inform your work, such as manufacturing methods and cost, reliability, variability of incoming parts, and tolerances on all specifications
Perform hands-on lab tests of equipment from component to rack and facility level for design and model validation. Document thermal test plans, devise and build test stands, including techanical support, cooling liquid supply, power delivery, metrology and instrumentation, compute workload, experiment control, and data recording
Analyze test data to draw inferences about the equipment tested. Apply statistical methods as required to maximize utilization of data and test usefulness
Work with multi-disciplinary groups to define system requirements and design products
Work with cross-functional teams to identify root causes of system performance
Qualification
Required
Master's degree in Engineering
Relevant coursework in heat transfer and fluid mechanics
Good familiarity with 3D software applications
Complete ownership of thermal design for various electronic products from thermal modeling, design, test, and design revision, until transfer to manufacturing
Conduct thermal simulations, postprocessing, and analysis ranging from chip to facilities level to verify thermal feasibility, risk, and to inform designs
Maintain awareness of heat transfer hardware available from all sources, including how it operates and performs, its cost, and how it can be incorporated into products
Conceive and implement ways to enhance and extend operation of heat transfer hardware
Consider the thermal aspects of chip packaging technologies
Apply best-in-class fluid flow geometry and technology to cool high heat flux chips
Determine and consider the effects of contact resistance and the use of Thermal Interface Materials
Apply air cooling when possible and liquid cooling when necessary to achieve full performance and reliability at the lowest cost
Size liquid cold plates, heat sinks, heat pipes, air movers, air filters, air ducting, and perforated plates
Plan work to achieve full required performance, and stay on schedule to support overall product development
Reference real world limitations to inform work, such as manufacturing methods and cost, reliability, variability of incoming parts, and tolerances on all specifications
Perform hands-on lab tests of equipment from component to rack and facility level for design and model validation
Document thermal test plans, devise and build test stands, including technical support, cooling liquid supply, power delivery, metrology and instrumentation, compute workload, experiment control, and data recording
Analyze test data to draw inferences about the equipment tested
Apply statistical methods as required to maximize utilization of data and test usefulness
Work with multi-disciplinary groups to define system requirements and design products
Work with cross-functional teams to identify root causes of system performance
Occasional overnight travel is required
Preferred
Master's degree in Thermodynamic Engineering
Company
Celestica
Celestica is a manufacturing firm that provides design, hardware platform, and supply chain solutions to a multitude of industries.
Founded in 1994
10001+ employees
H1B Sponsorship
Celestica has a track record of offering H1B sponsorships. Please note that this does not
guarantee sponsorship for this specific role. Below presents additional info for your
reference. (Data Powered by US Department of Labor)
Distribution of Different Job Fields Receiving Sponsorship
Represents job field similar to this job
Trends of Total Sponsorships
2025 (13)
2024 (3)
2023 (6)
2020 (3)
Funding
Current Stage
Public CompanyTotal Funding
$1.47B2024-06-20Post Ipo Debt· $657.67M
2023-06-05Post Ipo Secondary· $148.8M
2021-09-30Post Ipo Debt· $660.4M
Leadership Team
Robert Mionis
President and CEO
Jonathan Baksh
Vice President Finance, Advanced Technology Solutions (ATS)
Recent News
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