Apple · 1 month ago
IC Package Integration Lead
San Francisco Bay Area
Full-time
Onsite
Senior Level, Lead/Staff
$181K/yr - $318K/yr
10+ years expApple is a leading technology company known for its innovative products and services. They are seeking a passionate IC Packaging Engineering Lead to work on groundbreaking technologies and lead package integration and architecture efforts, ensuring that designed packages meet various engineering requirements.
AppsArtificial Intelligence (AI)BroadcastingDigital EntertainmentFoundational AIMedia and EntertainmentMobile DevicesOperating SystemsTVWearables
Responsibilities
Lead package co-design efforts with Silicon, Packaging, and Systems engineering teams to ensure designed packages meet electrical, mechanical, thermal, reliability and fit requirements
Drive package technology development which has broad impact (new technology, structure development, enhanced performance, lower cost)
Co-work with assembly partners on new packages from development, NPI, Qualification to high volume production
Create package design documentation, design rules, technical risk assessment, package checklist for Silicon TO, Development and release to production teams
Qualification
Required
BS and 10+ years of relevant industry experience
Work with cross-functional teams and lead package integration and architecture efforts
Work with 3rd party and OSAT to bring packaging solution from concept to HVM Drive industry with advanced package solutions and specs
Work to bring innovative packaging solutions from concept to mass production, including package, module, and technology development
People managerial skills highly desirable
Travel – 5-10%
Preferred
Experience in Semiconductor Packaging Design, Process & Technology Development
Managerial skills highly desired
Good understanding of cross-functional packaging areas: Si floor plan, package layout and architecture, enabling process technologies, thermal, mechanical, SI/PI, material, component & system level reliability, testing, and FA
Knowledgeable in advanced packaging technologies: Knowledge and insight to deliver high density / high performance interconnects in various form factor, thermo-mechanical, reliability, and cost constraints
Background and Knowledge of Cellular/Connectivity/PMU packaging highly desirable
Excellent problem solving with strong physics and fundamentals
Excellent communication skills that enable the candidate to work well with internal cross functional teams and overseas suppliers
Multi-functional coverage on package layout (Cadence APD/Allegro), critical signal integrity / power integrity, thermal, design rules, BOM, design for manufacturing, reliability, and cost
Ability to work independently and take on projects with minimum supervision
Ability to lead and manage teams
Benefits
Comprehensive medical and dental coverage
Retirement benefits
A range of discounted products and free services
Reimbursement for certain educational expenses — including tuition
Discretionary bonuses or commission payments
Relocation
Company
Apple
Apple is a technology company that designs, manufactures, and markets consumer electronics, personal computers, and software.
10001+ employees
H1B Sponsorship
Apple has a track record of offering H1B sponsorships. Please note that this does not
guarantee sponsorship for this specific role. Below presents additional info for your
reference. (Data Powered by US Department of Labor)
Distribution of Different Job Fields Receiving Sponsorship
Represents job field similar to this job
Trends of Total Sponsorships
2025 (6998)
2024 (3766)
2023 (3939)
2022 (4822)
2021 (4060)
2020 (3656)
Funding
Current Stage
Late StageTotal Funding
$5.67BKey Investors
Berkshire HathawayMicrosoftSequoia Capital
2026-01-10Pre Seed· $1M
2025-05-05Post Ipo Debt· $4.5B
2025-01-16Post Ipo Debt· $0.31M
Leadership Team
Tim Cook
CEO
Craig Federighi
SVP, Software Engineering
Recent News
Venrock
2025-12-01
2025-09-25
Mac Daily News
2025-09-25
Company data provided by crunchbase