Qualcomm · 4 hours ago
Thermal Engineer
San Diego, CA
Full-time
Onsite
Entry, Mid Level
$116K/yr - $173K/yr
2+ years expQualcomm is actively seeking a thermal engineer for the Design Technology (Dtech) SoC thermal analysis team. The candidate will deliver critical thermal analysis results to enable key product decisions and develop new thermal analysis methodologies to optimize SoC performance for Qualcomm’s mobile and compute products.
Artificial Intelligence (AI)Generative AISoftwareTelecommunicationsWireless
Responsibilities
Support SoC design by providing thermal analysis throughout the product development cycle to identify and address thermal risks, including thermal analysis, post silicon validation and working with external customers
Conduct SoC level thermal analysis to support architecture and product specification studies and Power Performance Area Thermal Optimization
Model and recommend SoC-level floorplan, performance, and thermal control optimization
Develop new computational thermal methodologies and software tools, develop and implement new work processes to enable scalability and efficiency, work with cross-functional and cross-organizational teams to achieve goals
Qualification
Required
Master's degree in Science, Engineering, or related field and 2+ years as a thermal engineer with a demonstrated competence in thermal analysis methodologies, strong physics knowledge, and experience interacting with external teams
PhD in Science, Engineering, or related field with a demonstrated competence in developing and driving thermal analysis methodologies and analysis and experience interacting with external teams
Bachelor's degree in Science, Engineering, or related field and 2+ years of ASIC design, verification, validation, integration, or related work experience
Master's degree in Science, Engineering, or related field and 1+ year of ASIC design, verification, validation, integration, or related work experience
PhD in Science, Engineering, or related field
Preferred
Master's or PhD in Science, Engineering, or related field
Strong background in heat transfer and fluid mechanics simulation methods and fundamentals (CFD or FEM) through graduate level course work or industry experience
Strong background in computer programming for numerical simulation and scripting skills for automation
Experience with thermal simulation methodologies and simulation tools such as ANSYS ICEPAK
Experience with measurement: IR camera, thermocouples
Experience with thermal materials: Graphite sheet, thermal paste, TIM, heat pipe
Excellent people skills and used to operating in networked and virtual team environments
Natural self-starter, self-motivated, independent and resourceful problem solver
Outstanding oral and written communication skills capable of presenting persuasively to all levels of the organization in an articulate and succinct manner
Active listening ability
Ability to establish relationships to build credibility and influence at all levels of the organization in appropriate manners
Benefits
Competitive annual discretionary bonus program
Opportunity for annual RSU grants
Highly competitive benefits package
Company
Qualcomm
Qualcomm designs wireless technologies and semiconductors that power connectivity, communication, and smart devices.
10001+ employees
H1B Sponsorship
Qualcomm has a track record of offering H1B sponsorships. Please note that this does not
guarantee sponsorship for this specific role. Below presents additional info for your
reference. (Data Powered by US Department of Labor)
Distribution of Different Job Fields Receiving Sponsorship
Represents job field similar to this job
Trends of Total Sponsorships
2025 (1752)
2024 (1910)
2023 (3216)
2022 (2885)
2021 (2104)
2020 (1181)
Funding
Current Stage
Public CompanyTotal Funding
$3.5M1991-12-20IPO
1988-01-01Undisclosed· $3.5M
Leadership Team
Cristiano Amon
President and Chief Executive Officer
I
Isaac Eteminan
CEO
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2025-12-24
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