Apple · 2 months ago
Packaging Substrate Engineer
Apple is a leading technology company known for its innovative consumer electronic products. The Packaging Substrate Engineer will be responsible for developing and optimizing packaging solutions for Apple's hardware components, collaborating with cross-functional teams to ensure high performance and reliability.
AppsArtificial Intelligence (AI)BroadcastingDigital EntertainmentFoundational AIMedia and EntertainmentMobile DevicesOperating SystemsTVWearables
Responsibilities
Work with industry partners to develop new substrate technologies from concept to HVM for Apple packaging roadmap
Work with cross-functional groups to define & optimize new package substrate architectures based on performance, technical risk, cost, and availability etc
Problem solving of technical issues during the full product development cycle
Qualification
Required
BS and 10+ years of relevant industry experience
Preferred
MS or Ph.D. and 8+ years of relevant industry experience
Proven fundamentals in material/chemistry/mechanical engineering field(s)
In-depth knowledge of substrate technology, manufacturing process, design rules, and roadmap
Hands-on experience in substrate manufacturing and technology development: Cu plating, lithography, dielectric material, via formation, solder resist, surface finish etc
Familiarity with package assembly and integration process preferred
Experience in Cadence Allegro platform tools and design review for manufacturing (DFM)
Exceptional technology development & project management skills
Strong communication & collaborative skills
Benefits
Comprehensive medical and dental coverage
Retirement benefits
A range of discounted products and free services
Reimbursement for certain educational expenses — including tuition
Discretionary bonuses or commission payments
Relocation
Company
Apple
Apple is a technology company that designs, manufactures, and markets consumer electronics, personal computers, and software.
H1B Sponsorship
Apple has a track record of offering H1B sponsorships. Please note that this does not
guarantee sponsorship for this specific role. Below presents additional info for your
reference. (Data Powered by US Department of Labor)
Distribution of Different Job Fields Receiving Sponsorship
Represents job field similar to this job
Trends of Total Sponsorships
2025 (6998)
2024 (3766)
2023 (3939)
2022 (4822)
2021 (4060)
2020 (3656)
Funding
Current Stage
Public CompanyTotal Funding
$5.67BKey Investors
Berkshire HathawayMicrosoftSequoia Capital
2025-05-05Post Ipo Debt· $4.5B
2025-01-16Post Ipo Debt· $0.31M
2021-04-30Post Ipo Equity
Leadership Team
Tim Cook
CEO
Craig Federighi
SVP, Software Engineering
Recent News
Venrock
2025-12-01
2025-09-25
Mac Daily News
2025-09-25
Company data provided by crunchbase