Engineer, Semi Packaging Engineering jobs in United States
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Analog Devices · 7 hours ago

Engineer, Semi Packaging Engineering

Analog Devices, Inc. is a global semiconductor leader that bridges the physical and digital worlds. They are seeking an Engineer in Semi Packaging Engineering to analyze manufacturing processes, design passive components, and collaborate with various teams to ensure high-quality module development.

DSPElectronicsLightingSemiconductor
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H1B Sponsor Likelynote

Responsibilities

Analyze manufacturing processes to fix passive component issues from customer returns and new product qualification
Design passive components using simulation models generated in Ansys Maxwell and SolidWorks for application-specific modules
Generate footprints, symbols, and mechanical drawings for all module components
Conduct Bill of Materials analysis, verification, and pricing to ensure cost-effective, high-quality modules and supply chain reliability
Work collaboratively with internal labs and design engineers to design, assemble, and test new modules (SiP, open frame) board-level and solder joint reliability
Perform competitive module analysis and new component Construction/Destructive Analysis using equipment for internal and external imaging, electrical characterization, and mechanical verification
Work collaboratively with component vendors and internally with design, reliability, procurement, and applications teams to create custom components for modules

Qualification

SolidWorksANSYS MaxwellThermal analysisMechanical analysisElectromagnetic analysisFailure analysisComponent developmentCollaborationCommunicationProject management

Required

Must have a Bachelor's degree in Mechanical Engineering or closely related field (willing to accept foreign education equivalent)
Two (2) years of experience in job offered or closely related occupation using and designing passive components in modules
Demonstrated Expertise (DE) developing thermal, mechanical and electromagnetic advanced 'virtual prototyping' simulation methodology using SolidWorks and ANSYS Maxwell to support advanced technology developments of passive components used in complex (3D) power SiP packaging
DE interfacing with high-level customers, design engineers, and package engineers in early advanced technology development activities, such as simulating and analyzing technology options to provide optimal thermal, mechanical, and electrical solutions
DE generating high level component analysis reports for manufacturability and quality in production, including mechanical and electrical properties
DE using failure analysis equipment to capture equipment for internal and external imaging, electrical characterization, and mechanical verification
DE managing all component development activities and manufacturing issues from beginning to end, which includes conducting regular status meetings with world-wide groups, publishing and updating milestones, assessing final data, and distributing final reports

Benefits

Medical, vision and dental coverage
401k
Paid vacation
Holidays
Sick time
Other benefits

Company

Analog Devices

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Analog Devices (NYSE: ADI) defines innovation and excellence in signal processing. ADI's analog, mixed-signal, and digital signal

H1B Sponsorship

Analog Devices has a track record of offering H1B sponsorships. Please note that this does not guarantee sponsorship for this specific role. Below presents additional info for your reference. (Data Powered by US Department of Labor)
Distribution of Different Job Fields Receiving Sponsorship
Represents job field similar to this job
Trends of Total Sponsorships
2025 (254)
2024 (145)
2023 (180)
2022 (148)
2021 (139)
2020 (166)

Funding

Current Stage
Public Company
Total Funding
$4.6M
Key Investors
U.S. Department of Defense
2025-04-11Post Ipo Debt
2024-09-18Grant· $4.6M
2012-04-02IPO

Leadership Team

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Vincent Roche
Chief Executive Officer and Chair of the Board of Directors
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Alan Lee
Chief Technology Officer
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Company data provided by crunchbase