Texas Instruments · 8 hours ago
Product Engineering Intern - Lehi
Lehi, UT
Internship
Onsite
InternTexas Instruments is a global semiconductor design and manufacturing company that develops analog ICs and embedded processors. As an ATD Product Engineering intern, you will gain exposure to multiple engineering disciplines and work on projects related to semiconductor fabrication, circuit design, and statistical analysis.
ComputerDSPSemiconductor
Responsibilities
Have significant exposure to multiple engineering disciplines
Assigned to project(s) that will provide the opportunity for learning semiconductor fabrication
Circuit design and simulation
Wafer level electrical testing
Statistical analysis methods to analyze large datasets and improve technology while interfacing with adjacent engineering groups
Qualification
Required
Pursuing a Master's degree in Electrical Engineering, Electrical & Computer Engineering, Computer Engineering or related field
Cumulative 3.0/4.0 GPA, or higher
Preferred
Coursework or experience in Analog or Digital VLSI design
Strong foundation in semiconductor device physics
Basic programming experience with C/C++, or any of the scripting language – Perl/Python
Strong verbal and written communication skills
Ability to work in teams and collaborate effectively with people in different functions
Ability to take the initiative and drive for results
Strong time management skills that enable on-time project delivery
Demonstrated ability to build strong, influential relationships
Benefits
Competitive pay and benefits designed to help you and your family live your best life
Company
Texas Instruments
Texas Instruments is a global semiconductor company that manufactures, designs, tests, and sells embedded and analog processing chips.
Founded in 1930
10001+ employees
H1B Sponsorship
Texas Instruments has a track record of offering H1B sponsorships. Please note that this does not
guarantee sponsorship for this specific role. Below presents additional info for your
reference. (Data Powered by US Department of Labor)
Distribution of Different Job Fields Receiving Sponsorship
Represents job field similar to this job
Trends of Total Sponsorships
2025 (189)
2024 (184)
2023 (148)
2022 (222)
2021 (165)
2020 (179)
Funding
Current Stage
Public CompanyTotal Funding
$13.61BKey Investors
U.S. Department of Commerce
2025-05-20Post Ipo Debt· $1.2B
2024-12-20Grant· $1.61B
2024-05-28Post Ipo Equity· $2.5B
Leadership Team
Richard Templeton
President and Chief Executive Officer
Krunali Patel
Senior vice president and chief information officer
Recent News
2025-12-29
2025-12-29
Company data provided by crunchbase