Qorvo, Inc. · 9 hours ago
Packaging Engineer
Qorvo, Inc. supplies innovative semiconductor solutions and is looking for Semiconductor Packaging Engineers in RF Packaging to join their Packaging team in Richardson, Texas. The ideal candidate will develop new packaging technologies for next generation products and work collaboratively with design teams.
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Responsibilities
Provide best in class industry “know-how” to enable continued global leadership of Qorvo packaging solutions
Utilize program management methodology to plan, execute and monitor complex process and/or product development projects
Facilitate or lead cross-functional technical teams through New Product Introduction (NPI) and/or problem solving
Design for manufacturability and cost to ensure smooth transition to High Volume Manufacturing
Develop and deploy advanced design rules into next generation products
Work in collaboration with technology and business units to deploy next generation packaging solutions incorporating GaN, Si and GaAs semiconductor devices into products
Qualification
Required
BS degree or higher in Engineering or Material Science
Industry knowledge and experience of semiconductor packaging technologies
Background in process / packaging technologies preferably with direct experience in either RF Modules or high power and high frequency packages
Knowledgeable across a wide range of assembly, packaging, processes technologies and materials e.g, fan-out, wafer level packaging, SMT, Die Attach, Wire Bond / Flip Chip, Molding, interconnect, laminate, etc
Understanding of Design for Manufacturability and requirements needed to ramp these technologies in a high volume manufacturing environment
Ability to utilize SPC techniques, DOE, and structured problem solving methodologies (e.g. DMAIC, 8D)
Experience with Program Management Methodology
Company
Qorvo, Inc.
Qorvo (Nasdaq: QRVO) supplies innovative semiconductor solutions that make a better world possible.
Funding
Current Stage
Public CompanyTotal Funding
$350MKey Investors
Starboard Value
2025-10-28Acquired
2025-01-16Post Ipo Equity
2019-09-30Post Ipo Debt· $350M
Leadership Team
Recent News
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2025-12-30
2025-11-28
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