Lam Research ยท 1 week ago
Hardware Designer 2
Lam Research is dedicated to excellence in the design and engineering of etch and deposition products for the semiconductor industry. As an Electrical or Mechanical Hardware Designer, you will create innovative designs, apply digital design and CAD software, and implement solutions to improve costs and reliability in next-generation products.
CleanTechManufacturingSemiconductor
Responsibilities
Create detailed engineering drawings and CAD models for the design concepts and design changes of complex parts and assemblies
Implement design changes for parts and assemblies, including changes to address issues identified in supplier build or problem reports
Develop Piping and Instrumentation Diagram (P&ID), including system-level or customer-specific, for parts and assemblies to aid in the design process
Select OEM parts based on design requirements and best-known methods
Document and release engineering drawings, and bills of materials (BOM) using Engineering Change Management to support manufacturing
Create 3D electrical and pneumatical harness routing using CAD packages
Develop multi-CAD layouts for Lam products and manage larger scale 3D assemblies
Create and maintain detailed drawings of complex interconnect and cable assembly of Lam Products
Identify, qualify, and propose Commercially Off the Shelf (COTS) or OEM parts based on defined criteria
Create engineering documentation, identify technical risks, and conducts design reviews in support of design efforts
Advise supplier during product development phase to translate detailed engineering requirements into specifications and collaborate cross-functionally to provide design verification
Accountable for delivering on time with quality as part of Key Performance indicators (KPIs), as well as consistent improvement in efficiency
Qualification
Required
Bachelor's degree in Mechanical Engineering, Electrical Engineering, or related field with 2+ years of experience; or an advanced degree with no previous professional experience; or equivalent experience
Highly skilled in 3D CAD modeling tools such as CREO, Siemens NX, AutoCAD, SolidWorks, and others
Proficiency in concept design and development for mechanical components or sub-systems
Knowledge in creating drawings for sheet metal and machined parts
Experience with metal machining and sheet metal fabrication and casting processes
Fundamental understanding of mechanical engineering, engineering/design methods and processes, and engineering drawing
Solid knowledge on welding symbols, geometric dimensioning and tolerancing (GD&T) symbols, surface finish, and American Society of Mechanical Engineers (ASME) drafting standards
Experience with Cable Harness, Schematics and Interconnect using E3 Zuken, Ideas, or PCAD
Knowledge on selection of OEM Components and cable accessories
Understanding of design standards and compliance such as UL 508, IEC Standard, SEMI standard (Electrical), IPC 620, or similar
Knowledge on design for manufacturability in cable design
This is a graduate eligible role
Preferred
Prior experience in the semiconductor equipment industry
Experience in global cross-functional teams within a matrix organization
Understanding of Product Lifecycle Management (PLM) concepts
Familiarity with Bills of Material (BOM) structure and configuration, and use of SAP and PLM system software
Knowledge on industrial control panel design
Excellent communication, both written and verbal, and technical presentation skills
Benefits
Comprehensive set of outstanding benefits
Company
Lam Research
Lam Research supplies wafer fabrication equipment and services to the worldwide semiconductor industry.
H1B Sponsorship
Lam Research has a track record of offering H1B sponsorships. Please note that this does not
guarantee sponsorship for this specific role. Below presents additional info for your
reference. (Data Powered by US Department of Labor)
Distribution of Different Job Fields Receiving Sponsorship
Represents job field similar to this job
Trends of Total Sponsorships
2025 (242)
2024 (239)
2023 (170)
2022 (216)
2021 (242)
2020 (182)
Funding
Current Stage
Public CompanyTotal Funding
unknown1984-05-11IPO
Recent News
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2026-01-09
2026-01-05
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