Rambus · 5 hours ago
Digital Design Engineer - New College Grad
Rambus, a premier chip and silicon IP provider, is seeking a Digital Design Engineer - New College Grad to join their Memory Interface Chip team in San Jose. In this role, you will work with a team on new product development, focusing on RTL coding, functional simulation, and supporting chip bringing-up and debugging efforts.
ArchitectureLightingSemiconductor
Responsibilities
Work with analog/digital design team for new product development
Responsible for RTL coding, functional simulation, analog-block Verilog model, post-pr simulation
Support bench test, support ATE test
Support chip bringing-up, debugging, failure analysis, characterizations and product release efforts
Qualification
Required
Master degree or above in EE or related field
Experience in the area listed below: Embedded SRAM/OTP/Efuse/MTP controller
Experience in the area listed below: Design for test for digital block, analog block
Experience in the area listed below: Communication bus such as I2C/I3C/SPI/AHB/APB
Experience in the area listed below: Familiar to schematic editor
Self-motivated and proactive
Good communication skills and a strong team player
Preferred
Being Familiar to mixed signal design and backend is a plus
Mass product experience is a plus
Benefits
Competitive compensation package including base salary, bonus, equity, matching 401(k), employee stock purchase plan, comprehensive medical and dental benefits, time-off program, and gym membership
Company
Rambus
Rambus designs, develops and licenses chip interface technologies and architectures that are used in digital electronics products.
H1B Sponsorship
Rambus has a track record of offering H1B sponsorships. Please note that this does not
guarantee sponsorship for this specific role. Below presents additional info for your
reference. (Data Powered by US Department of Labor)
Distribution of Different Job Fields Receiving Sponsorship
Represents job field similar to this job
Trends of Total Sponsorships
2025 (25)
2024 (16)
2023 (7)
2022 (8)
2021 (3)
2020 (11)
Funding
Current Stage
Public CompanyTotal Funding
$288.57M2023-07-20Acquired
2011-06-07Post Ipo Equity· $88.57M
2010-02-02Post Ipo Equity· $200M
Recent News
Business Wire
2025-11-05
2025-11-01
Yahoo Finance
2025-10-30
Company data provided by crunchbase