Micron Technology · 1 month ago
Principal Engineer - DRAM Design Rule
Boise, ID - Main Site
Full-time
Onsite
Senior Level, Lead/Staff
5+ years expMicron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence. They are seeking a highly experienced Principal Engineer to lead Design Enablement efforts for DRAM technologies, focusing on developing design rules and collaborating with various teams to optimize performance and manufacturing processes.
ComputerHardwareManufacturingSemiconductor
Responsibilities
Lead efforts to develop and refine Design Rules, Requirements, and Test Structures for all DRAM generations
Manage test structure evaluation to support next-gen device development and quantify process margins
Define sub-milestones within layout schedules and ensure timely execution across teams
Address process window vs. die size issues arising from database layout techniques
Collaborate with Design, Product Engineering, Process Integration, Business Units, and Quality teams to optimize PPAC (Performance, Power, Area, Cost)
Ensure robust Design Rule Checks (DRC) and appropriate responses to deviations
Strategically partner with teams to resolve process issues related to layout and prioritize solutions
Document and communicate complex problem resolutions and drive cross-node design rule alignment
Maintain effective communication across Process Integration, Product Engineering, Design, and Advanced Mask teams
Improve documentation of R&D activities for design rule improvement
Ability to define and implement design rules within APR workflows to enhance layout efficiency and manufacturability
Qualification
Required
BS/MS/PhD in Electrical Engineering, Microelectronics, Physics or related field
Senior level engineer with 5 - 10+ years of experience in the semiconductor industry in the areas of Process Integration, Yield Enhancement, Product Engineering, Design, Test Structure Development, or Unit Process Development
Experience with Test Structure Design and characterization
Possess a deep understanding of the DRAM process flow, as well as the function and purpose of major DRAM components, such as Sense Amp, Word-line driver, and Anti-Fuse
Exposure and familiarity with CAD group interactions, data post-processing, and the process of transferring data from the database to the reticle
Preferred
Solid grasp and exposure to design & layout with the ability to do minor layout, work with Pcells is desired
Think and communicate clearly in urgent and stressful situations
Demonstrated success in resolving sophisticated issues
Benefits
Medical, dental and vision plans
Benefit programs that help protect your income if you are unable to work due to illness or injury
Paid family leave
Robust paid time-off program
Paid holidays
Company
Micron Technology
Micron Technology is a semiconductor company that produces DRAM, SDRAM, flash memory, SSD and CMOS image sensing chips.
10001+ employees
H1B Sponsorship
Micron Technology has a track record of offering H1B sponsorships. Please note that this does not
guarantee sponsorship for this specific role. Below presents additional info for your
reference. (Data Powered by US Department of Labor)
Distribution of Different Job Fields Receiving Sponsorship
Represents job field similar to this job
Trends of Total Sponsorships
2025 (573)
2024 (429)
2023 (299)
2022 (626)
2021 (564)
2020 (538)
Funding
Current Stage
Public CompanyTotal Funding
$8.9BKey Investors
U.S. Department of Commerce
2025-04-24Post Ipo Debt· $1.75B
2025-01-16Post Ipo Debt· $1B
2024-04-18Grant· $6.1B
Leadership Team
Sanjay Mehrotra
Chairman, President & CEO
Gursharan Singh
Senior Vice President BE Operations
Recent News
2026-01-14
Digital Trends
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