Broadcom · 4 days ago
Failure Analysis Engineer
Fort Collins, CO
Full-time
Onsite
Mid, Senior Level
$108K/yr - $173K/yr
6+ years expBroadcom is seeking an experienced and driven Failure Analysis Engineer. In this role, you will be the technical lead who ensures the successful diagnosis and characterization of complex failures in advanced silicon and packaging technologies critical to Broadcom’s most sophisticated products.
MobileSemiconductorWireless
Responsibilities
Hands on technical expert capable of in depth fault analysis across a wide range of silicon and package technology
Plan and execute individual FA plans through background data collection, ATE datalog interpretation, non-destructive analysis (optical, CSAM, X-Ray, TDR, IV curve trace)
Fault localization (ATE, application board, PEM, DLS, OBIRCh, thermal, scan, memory)
Physical Analysis (mechanical, chemical, PFIB), nanoprobing, and analytical techniques (FIB, SEM, EDX) to isolate and characterize defects
Collaborate with global cross-functional teams (design, process, test, reliability) to identify root causes of failures from various stages of the product lifecycle (e.g., design, reliability, RMA)
Clear communication of complex FA findings, both written and verbal, to enable data-driven corrective action of critical quality issues
Develop and implement new failure analysis methodologies and procedures unique to advanced silicon & packaging technologies to enhance efficiency and effectiveness
Evaluate & stay updated on the latest advancements in failure analysis techniques and semiconductor technology
Team-based culture through open communication, continuous improvement, and willingness to assist others
Qualification
Required
Bachelor's and 8+ years of relevant experience, or Master's degree in Electrical Engineering, Mechanical Engineering, Chemical Engineering, Materials Science, or a related field and 6+ years of relevant experience
Strong understanding of semiconductor device physics, fabrication processes, and packaging technologies
Proficiency in various failure analysis techniques and equipment (e.g., scan diagnostics, PEM, DLS, nanoprobing, SEM, EDS, FIB)
Excellent problem-solving skills and a methodical approach to root cause analysis
Ability to work independently and as part of a team in a fast-paced environment
Broad interests, self-driven, lifelong learner, and a good team member
Expert project management skills, capable of managing multiple root cause projects in conjunction with lab support
Preferred
Experience with 3DICs, CoWoS-L, co-packaged optics (CPO), or co-packaged copper (CPC)
Expertise in design-based FA (scan and memory diagnostics)
Expertise in beam-based FA techniques (e.g., nanoprobing, PFIB delayering / cross-section)
ATE test flow generation, pattern modification, and hardware
In-depth knowledge of advanced package construction and failure analysis
Benefits
Medical, dental and vision plans
401(K) participation including company matching
Employee Stock Purchase Program (ESPP)
Employee Assistance Program (EAP)
Company paid holidays
Paid sick leave and vacation time
Paid Family Leave and other leaves of absence
Company
Broadcom
Broadcom is a designer, developer, and global supplier of a broad range of analog and digital semiconductor connectivity solutions.
10001+ employees
H1B Sponsorship
Broadcom has a track record of offering H1B sponsorships. Please note that this does not
guarantee sponsorship for this specific role. Below presents additional info for your
reference. (Data Powered by US Department of Labor)
Distribution of Different Job Fields Receiving Sponsorship
Represents job field similar to this job
Trends of Total Sponsorships
2025 (92)
2024 (77)
2023 (79)
2022 (112)
2021 (110)
2020 (89)
Funding
Current Stage
Public CompanyTotal Funding
unknown2017-10-31Post Ipo Equity
2015-05-28Acquired
1998-04-17IPO
Leadership Team
Greg Singh
CTO for APJ, Enterprise Security Group
Kirsten Spears
CFO and CAO, Broadcom
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