Microchip Technology Inc. · 2 days ago
Engineer II - Foundry (Wafer Foundry Management)
Microchip Technology Inc. is a global organization that designs technology powering the world. They are seeking an Engineer II to manage wafer foundry processes, perform cost analyses, and handle contracts with foundries.
Responsibilities
Understand wafer foundry process technologies(DRs, Process flows, PDKs, etc.)
Understand a range of circuit types which make up Microchip products to be analyzed
Perform die size estimates and cost analysis for the diversified product lines and product configurations on multiple technologies to support BU on technology selection
Identify gaps in a wafer foundry technology offering and help drive those to closure
Handle Commercials and contracts for the assigned wafer foundries
Qualification
Required
Master's degree in Electronic Engineering
Strong motivation to learn
Excellent communication skills
Ability to work efficiently with external foundry partners as well as MCHP internal functional teams worldwide
Preferred
0-3 years of experience in semiconductor device physics and process technology preferred
0-3 years of experience in integrated circuit design, layout, and related EDA tool a plus
0-3 years of experience in SRAM and NVM a plus
Company
Microchip Technology Inc.
Microchip Technology Inc. is a leading semiconductor supplier of smart, connected and secure embedded control solutions.
H1B Sponsorship
Microchip Technology Inc. has a track record of offering H1B sponsorships. Please note that this does not
guarantee sponsorship for this specific role. Below presents additional info for your
reference. (Data Powered by US Department of Labor)
Distribution of Different Job Fields Receiving Sponsorship
Represents job field similar to this job
Trends of Total Sponsorships
2025 (170)
2024 (113)
2023 (116)
2022 (119)
2021 (94)
2020 (100)
Funding
Current Stage
Public CompanyTotal Funding
$2.42BKey Investors
Opportunity Now ColoradoSevenBridge Financial GroupSequoia Capital
2025-03-21Post Ipo Equity· $1.32B
2024-05-29Post Ipo Debt· $1.1B
2024-03-19Grant· $1.06M
Recent News
2026-01-06
2026-01-06
2026-01-06
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