Cadence · 4 months ago
Intern CPG
CORK 01
Internship
Onsite
InternCadence is a technology company focused on electronic design automation. The Intern in Technical Communications will gain hands-on experience and develop documentation to assist customers in utilizing EDA products effectively.
AerospaceElectronic Design Automation (EDA)HardwareMobileSemiconductorSoftware
Responsibilities
This Internship with the CPG Technical Communications team at Cadence will provide you hands-on experience of working on cutting-edge electronic design automation (EDA) products in the Custom IC and PCB domains
Developing instructionally sound documentation that helps customers make best use of these products in their design flows
The role will give you exposure to software and document development processes, and an opportunity to work on multiple customer-centric technical communication tasks, ranging from reviewing product messages and software UI to developing feature videos and blogs
As part of this role, you will have to interact with cross-functional teams, particularly with subject-matter experts (R&D and product engineering teams) located in different geos for ensuring technical accuracy of the content
Qualification
Required
Bachelors/Master's program in any discipline
Passion for technology, media communication, and writing
Strong language skills
Flair for writing
Interest in understanding technical concepts and flows
Ability to deconstruct technical concepts to produce comprehensible information
Preferred
Computer Science
Electronics Engineering
Technical Communications
Instructional Design
Company
Cadence
Cadence is a market leader in AI and digital twins, pioneering the application of computational software to accelerate innovation in the engineering design of silicon to systems.
Founded in 1988
10001+ employees
H1B Sponsorship
Cadence has a track record of offering H1B sponsorships. Please note that this does not
guarantee sponsorship for this specific role. Below presents additional info for your
reference. (Data Powered by US Department of Labor)
Distribution of Different Job Fields Receiving Sponsorship
Represents job field similar to this job
Trends of Total Sponsorships
2025 (306)
2024 (221)
2023 (282)
2022 (330)
2021 (233)
2020 (209)
Funding
Current Stage
Public CompanyTotal Funding
unknown1998-02-20IPO
Leadership Team
Paul Cunningham
Senior Vice President and General Manager
Tom Beckley
Senior Vice President, Custom IC & PCB Group
Recent News
2026-01-17
GlobeNewswire
2026-01-16
Company data provided by crunchbase