Broadcom · 3 days ago
Board Mechanical Engineer
Duluth, GA
Full-time
Onsite
Mid, Senior Level
$91K/yr - $146K/yr
5+ years expBroadcom is a leading technology company that designs and develops hardware products. The Board Mechanical Engineer will be responsible for evaluating the reliability of materials and techniques used in production, and developing thermal and mechanical solutions for electronic components and systems.
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Responsibilities
Works on problems of diverse scope where analysis of data requires evaluation of identifiable factors. Demonstrates good judgment in selecting methods and techniques for obtaining solutions
May coordinate work with third parties, vendors, or trade customers
Work is independent and collaborative in nature. Provides regular updates to manager on project/account status
Interprets product requirement information into required thermal and mechanical solutions
Works with lab personnel to facilitate testing of design solutions
Works with design team to determine location of components on PCBA for an optimal thermal/mechanical solution
Works with test labs to coordinate/perform reliability testing of design
Communicates with external mechanical suppliers that can provide innovative solutions to complicated thermal and mechanical issues
Works on multiple assignments keeping marketing and management informed of progress and roadblocks
Qualification
Required
Bachelors and 5+ years of related experience or Masters degree and 3+ years of related experience or PhD and no experience
Work on cross-functional teams both internal and external to Broadcom
Extensive experience solving challenging thermal system-level problems preferably with blade, dense servers and laptop solutions
Thermal simulation experience solving thermal issues with mechanical multi-board assemblies
Airflow modeling with high end simulators
Correlating empirical and theoretical data
Designing and building thermal test apparatus for evaluating possible solutions to be used in an environmental chamber
Design heatsink and other thermal transport material (fans, blowers, heat pipes, …)
Apply Finite Element Analysis (FEA) tools with the ability to create technical documentation
Perform thermal analysis' and create engineering drawings
Proficient with Microsoft Office products
Proficient in designing for high volume hard tooling of parts to include: sheet metal stampings, metal extrusions, injection molded plastic and die cast
Work with Product Managers and Marketing for next generation feasibility studies
Preferred
Design of mechanical and thermal solutions for PCB level systems using Creo (Pro/Engineer) CAD system
Simulation of PCB level thermal solutions using FloTHERM CFD system
Apply Ansys Finite Element Analysis (FEA) tool with the ability to create technical documentation
Perform tolerance analysis' and create engineering drawings
Possess expertise in the design for EMI containment with the understanding of industry practices and materials
Manage the program aspects of the project including planning, scheduling, and project reporting with LSI resources and LSI's ODMs
Comfortable discussing problems and potential solutions with upper management
Benefits
Medical, dental and vision plans
401(K) participation including company matching
Employee Stock Purchase Program (ESPP)
Employee Assistance Program (EAP)
Company paid holidays
Paid sick leave and vacation time
The company follows all applicable laws for Paid Family Leave and other leaves of absence.
Company
Broadcom
Broadcom is a designer, developer, and global supplier of a broad range of analog and digital semiconductor connectivity solutions.
10001+ employees
H1B Sponsorship
Broadcom has a track record of offering H1B sponsorships. Please note that this does not
guarantee sponsorship for this specific role. Below presents additional info for your
reference. (Data Powered by US Department of Labor)
Distribution of Different Job Fields Receiving Sponsorship
Represents job field similar to this job
Trends of Total Sponsorships
2025 (92)
2024 (77)
2023 (79)
2022 (112)
2021 (110)
2020 (89)
Funding
Current Stage
Public CompanyTotal Funding
unknown2017-10-31Post Ipo Equity
2015-05-28Acquired
1998-04-17IPO
Leadership Team
Greg Singh
CTO for APJ, Enterprise Security Group
Kirsten Spears
CFO and CAO, Broadcom
Recent News
2026-01-07
The Motley Fool
2026-01-07
Company data provided by crunchbase