onsemi · 2 days ago
Process Engineer Development
onsemi is driving disruptive innovations to help build a better future. The Process Engineer will work in the Technology Development group focusing on continuous improvement of new processes, product architecture, and technologies, while ensuring successful product development and ramping to volume manufacturing.
AutomotiveCommercialConsumer ElectronicsEnergyEnergy EfficiencyInternet of ThingsRenewable EnergySalesSensor
Responsibilities
Support product development from initial design through full-scale manufacturing, ensuring complete documentation for ONSEMI’s process change review process
Collaborate with Manufacturing Engineering to recommend and implement manufacturable process recipes that meet yield and reliability targets
Demonstrate understanding of semiconductor technology, device physics, yield improvement, and manufacturing processes
Experience with several different processes such as sputter, insulator deposition, RIE, and copper plating
Experience with wafer bow engineering through multi-film stress modulation is highly desired
Chip Package Interaction (CPI) experience is a plus
Familiarity with different Packaging technologies
Chip scale module construction
Power FET experience, Power Module experience
Experience with Pick and Place, sintering, Polyimide, or benzocyclobutene (BCB)
Proficiency in MS Excel, PowerPoint, Word, MS Project
Skilled in yield analysis tools such as Shiny, Excensio, JMP, Minitab, etc
Automation processing software such as SiView
Work effectively within a global matrixed team and independently drive projects to completion
Communicate clearly with all levels of the organization, including executive leadership
Operate independently, translating high-level objectives into detailed execution plans
Act as a team player with strong listening skills, able to incorporate input and make informed decisions
Qualification
Required
Education: BS in Engineering or Material Science, MS+ preferred
Experience: 6-10 years or more of relevant experience in semiconductor manufacturing integration and technology development
Familiar with 5S, 8D, 6-sigma, SPC, DOE, FMEA
Language Fluency – Fluent in English Language, written & verbal
Preferred
Experience with wafer bow engineering through multi-film stress modulation is highly desired
Chip Package Interaction (CPI) experience is a plus
Familiarity with different Packaging technologies
Chip scale module construction
Power FET experience, Power Module experience
Experience with Pick and Place, sintering, Polyimide, or benzocyclobutene (BCB)
Proficiency in MS Excel, PowerPoint, Word, MS Project
Skilled in yield analysis tools such as Shiny, Excensio, JMP, Minitab, etc
Automation processing software such as SiView
Benefits
Competitive benefits package
Company
onsemi
onsemi (Nasdaq: ON) is driving disruptive innovations to help build a better future.
H1B Sponsorship
onsemi has a track record of offering H1B sponsorships. Please note that this does not
guarantee sponsorship for this specific role. Below presents additional info for your
reference. (Data Powered by US Department of Labor)
Distribution of Different Job Fields Receiving Sponsorship
Represents job field similar to this job
Trends of Total Sponsorships
2025 (144)
2024 (85)
2023 (80)
2022 (75)
2021 (68)
2020 (71)
Funding
Current Stage
Public CompanyTotal Funding
unknown2022-12-09Post Ipo Equity
2000-04-28IPO
Leadership Team
Recent News
2025-12-18
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2025-12-11
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2025-12-02
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