Celestial AI · 3 days ago
Silicon Packaging Layout Engineer
Santa Clara, CA
Full-time
Onsite
Mid Level
$165K/yr - $215K/yr
4+ years expCelestial AI is a company focused on advancing data center infrastructure through innovative technologies like their Photonic Fabric™. They are seeking an experienced Silicon Packaging Layout Engineer to lead the design and execution of advanced packaging architectures, collaborating with various engineering teams to ensure optimal manufacturing and assembly processes.
Semiconductors
Responsibilities
Support Silicon interposer and RDL based design planning and execution for advanced packaging architectures
Support bumpmap and test collateral release for test vehicle and product designs
Netlist management for heterogeneous chiplet assemblies using latest EDA solutions
Support all aspects of silicon layout based on I/O, SI-PI and form factor requirements, including routing, design for reliability, thermal, mechanical, manufacturability, bumping, substrate, material selection, assembly, and support for testing
Support cross-functional silicon layout needs
Support activities related to silicon manufacturing such as fab design reviews and tape-out aligned with OSAT requirements
Actively support test vehicle definition and design for assembly test vehicles
Qualification
Required
Education: BS in EE/ECE/MSE/ME/ChemE or related disciplines
Experience: 4 years of experience in silicon interposer and RDL designs for heterogeneous architectures
Technical Expertise: Experience working with design tools such as Cadence Virtuoso and Klayout
Technical Expertise: Familiarity with AutoCAD tools and file formats
Technical Expertise: Layout experience for various 2.5D/3D packaging technologies including InFO, CoWoS, FoCoS and EMIB
Technical Expertise: Familiarity with cross-functional packaging areas: Si floor plan, package, assembly design rules, BOM, enabling material/process technologies, thermal, mechanical, Signal/Power Integrity, design for manufacturing, assembly, reliability, and cost
Technical Expertise: Familiarity with photonics packaging is a plus but not necessary
Foundry and OSAT Engagement: Experience working with wafer foundries to meet design for manufacturing, yield, and reliability
Foundry and OSAT Engagement: Experience working with OSATs to meet assembly requirements
Industry Knowledge: Familiarity with latest advanced packaging architectures
Soft Skills: Strong analytical, problem-solving, cross-functional collaboration, project management, and technical presentation skills
Preferred
Experience in silicon layout for heterogeneous integration, fan-out packaging, chiplet architectures – co-design, physical layout, and netlist management
Experience with fab and assembly design rules
Experience in foundry and OSAT assembly engagement to meet manufacturing and assembly requirements
Benefits
Health, vision, dental and life insurance
Collaborative and continuous learning work environment
Company
Celestial AI
AI is touching our lives and driving breakthroughs in healthcare, finance, autonomous systems, and countless other domains.
51-200 employees
H1B Sponsorship
Celestial AI has a track record of offering H1B sponsorships. Please note that this does not
guarantee sponsorship for this specific role. Below presents additional info for your
reference. (Data Powered by US Department of Labor)
Distribution of Different Job Fields Receiving Sponsorship
Represents job field similar to this job
Trends of Total Sponsorships
2025 (15)
2024 (10)
2023 (4)
2022 (7)
2021 (1)
Funding
Current Stage
Growth StageLeadership Team
David Lazovsky
Founder, CEO
Recent News
Venture Capital Access Online
2025-03-13
2025-03-13
Company data provided by crunchbase