Texas Instruments · 1 day ago
Packaging Engineer
Santa Clara, CA
Full-time
Onsite
Senior Level, Lead/Staff
$150K/yr - $234K/yr
10+ years expTexas Instruments is a global semiconductor company that designs, manufactures, and sells analog and embedded processing chips. The Packaging Engineer will define, design, develop, and scale high voltage packages and modules for various markets, ensuring collaboration across teams and rapid time-to-market for new products.
ComputerDSPSemiconductor
Responsibilities
To define, design, develop and scale to volume production high voltage (200-3300V) packages and high-power modules for the Industrial, Automotive, Renewable and Telecom markets
The candidate must understand market trends & end equipment system requirements and build these into competitive forward-looking package and module roadmaps
The candidate must have the ability to define solutions across various HV technologies like GaN, SiC, IGBT and Isolation Technologies and validate these using CFD, thermomechanical and electrical parasitic extraction tools
The candidate will develop new process flows/technologies necessary to create 1 st article prototype and also scale to high volume manufacturing
The candidate should outline the package reliability plans, complete testing, summarize failure modes and provide solutions to address issues
The candidate must have a broad knowledge of the material supplier landscape (mold compounds, die attach, substrates) for high voltage applications as well as process / equipment integration and must work with various suppliers to provide solutions to meet TI roadmaps
The candidate must be a proven leader, capable of working collaboratively across worldwide cross functional teams and capable of accelerating development cycles and ensuring rapid time-to market for new products
Qualification
Required
Master's degree in Mechanical Engineering, Materials Science, Electrical Engineering or related engineering degree
10 + years of experience and proven track record of innovation in High Voltage (200V-3300V must) and high power (5KW – 300KW) semiconductor packaging across GaN / SIC / IGBT, Super Junction MOSFET technologies
Hands on high voltage package and power module design, materials, equipment, and assembly flow integration (molded packages like TOLT, TOLG, Q-DPAK DIP, SIP and case modules)
Strong knowledge of Silicon / GaN / SiC-package interaction and hands on experience with stress, thermal and electrical modeling analysis and tools
The candidate must understand market trends & end equipment system requirements and build these into competitive forward-looking package and module roadmaps
The candidate must have the ability to define solutions across various HV technologies like GaN, SiC, IGBT and Isolation Technologies and validate these using CFD, thermomechanical and electrical parasitic extraction tools
The candidate will develop new process flows/technologies necessary to create 1 st article prototype and also scale to high volume manufacturing
The candidate should outline the package reliability plans, complete testing, summarize failure modes and provide solutions to address issues
The candidate must have a broad knowledge of the material supplier landscape (mold compounds, die attach, substrates) for high voltage applications as well as process / equipment integration and must work with various suppliers to provide solutions to meet TI roadmaps
The candidate must be a proven leader, capable of working collaboratively across worldwide cross functional teams and capable of accelerating development cycles and ensuring rapid time-to market for new products
Preferred
Excellent communication skills and ability to work with internal and external customers to define and develop roadmaps
Prior experience scaling HV packages and modules from concept to high volume manufacturing
Good understanding of clip attach, flip chip packaging and overview of wafer bumping processes
Knowledge of magnetics and high power density enterprise power modules (6V – 48V) is a plus
Strong knowledge of HV Bill of Materials (Mold compounds, Die Attach, DBC substrates, etc.)
Good understanding of industry & subcon HV packaging capabilities & roadmaps
Overview of high voltage discrete and power modules reliability and qualification requirements, proven ability to define and drive reliability and qualification strategies in alignment with these standards and problem solving
Track record of presenting at international conferences or symposiums related to power electronics, semiconductor packaging, or high-voltage technologies
Benefits
Competitive pay and benefits designed to help you and your family live your best life
Company
Texas Instruments
Texas Instruments is a global semiconductor company that manufactures, designs, tests, and sells embedded and analog processing chips.
10001+ employees
H1B Sponsorship
Texas Instruments has a track record of offering H1B sponsorships. Please note that this does not
guarantee sponsorship for this specific role. Below presents additional info for your
reference. (Data Powered by US Department of Labor)
Distribution of Different Job Fields Receiving Sponsorship
Represents job field similar to this job
Trends of Total Sponsorships
2025 (189)
2024 (184)
2023 (148)
2022 (222)
2021 (165)
2020 (179)
Funding
Current Stage
Public CompanyTotal Funding
$13.61BKey Investors
U.S. Department of Commerce
2025-05-20Post Ipo Debt· $1.2B
2024-12-20Grant· $1.61B
2024-05-28Post Ipo Equity· $2.5B
Leadership Team
Richard Templeton
President and Chief Executive Officer
Krunali Patel
Senior vice president and chief information officer
Recent News
2026-01-07
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