TSMC · 1 month ago
Hookup Tool Design BIM Technician - Fixed Term
Phoenix, AZ
Contract
Onsite
New Grad, Entry LevelTSMC Arizona is a leading innovator in semiconductor manufacturing, and they are seeking a Hookup Tool Design BIM Technician to join their team. The role involves utilizing BIM software tools to create 3D models, coordinate between engineering and construction teams, and support the overall design and execution of FAB projects.
Consumer ElectronicsElectronicsManufacturingProduct DesignSemiconductor
Responsibilities
Utilize BIM software tools such as Revit, AutoCAD, Navisworks, and Bluebeam to create accurate 3D models, manage spatial layouts, and assist in space allocation for tools within FAB design projects
Support the coordination between engineering teams, construction teams, and various stakeholders such Facility engineers, (ISEP (Integrated Systems Engineering and Planning), IT, and AMHS (Automated Material Handling Systems)
Help engineers to conduct field observation for construction readiness. Check on-site conditions and compare it to 3D federated model
Help engineers to assign facility ports to the semiconductor tools and ensure tool requirements are met
Assist in refining design workflows to improve efficiency, reduce design cycle times, and maintain quality standards
Assist in collaborating on projects across FAB facilities in Taiwan , Japan , Europe , and any future TSMC global FAB expansions ensuring compliance with regional standards and cultural considerations
Track assigned tasks, report progress, and escalate any issues to the team leader or manager
Support the identification and mitigation of risks within the project's scope to ensure smooth execution
Use tools like Navisworks to conduct clash detection and help resolve coordination issues across disciplines
Maintain organized and detailed design documents according to project standards and company protocols
Qualification
Required
Applicants must be legally eligible to work in the United States
A high school diploma, GED, or equivalent
Familiarity and experience with BIM tools such as Revit, AutoCAD, and Navisworks (certifications in these tools are a plus)
Hands-on experience working in cleanroom environments, semiconductor construction, or general construction
Strong willingness to learn, improve, and grow within the company
Good interpersonal and communication skills to collaborate effectively with multidisciplinary teams
Ability to communicate and work in an English environment is a must (language ability in Mandarin, German, and Japanese is a plus)
A proactive attitude, strong problem-solving skills, and an eagerness to learn advanced skills through company training
Preferred
An associate degree in a technical or related field, relevant certification, military experience, or a trade school diploma
Previous experience in semiconductor fabrication facilities, cleanroom environments, or high-tech construction projects
Certification in CAD or BIM software tools
Experience with clash detection software such as Navisworks Manage
Knowledge of construction workflows, building codes, and standards
Basic programming skills or experience with automation tools (preferred but not required)
Benefits
Medical, Dental, and Vision Plans: Choose the options that best fit your and your family’s needs.
Income-Protection Programs: Financial assistance during injury or illness.
401(k) Retirement Savings Plan: Secure your financial future with competitive employer contributions.
Paid Time-Off Programs and Holidays: Recharge and spend quality time with loved ones.
Company
TSMC
Established in 1987, TSMC is the world's first dedicated semiconductor foundry.
Founded in 1987
10001+ employees
H1B Sponsorship
TSMC has a track record of offering H1B sponsorships. Please note that this does not
guarantee sponsorship for this specific role. Below presents additional info for your
reference. (Data Powered by US Department of Labor)
Distribution of Different Job Fields Receiving Sponsorship
Represents job field similar to this job
Trends of Total Sponsorships
2025 (49)
2024 (27)
2023 (30)
2022 (17)
2021 (31)
2020 (35)
Funding
Current Stage
Public CompanyTotal Funding
$14.2BKey Investors
U.S. Department of CommerceBerkshire Hathaway
2024-04-08Grant· $6.6B
2024-01-01Acquired
2022-09-30Post Ipo Equity· $4.1B
Leadership Team
Morris Chang
Founder, Chairman & CEO
Peter M. Cleveland
Senior Vice President
Recent News
2026-01-17
2026-01-17
Company data provided by crunchbase