Summer 2026 - Design Flow and Automation Engineer Intern (7263) jobs in United States
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TSMC · 2 months ago

Summer 2026 - Design Flow and Automation Engineer Intern (7263)

positionAustin, TX
timeInternship
remoteHybrid
seniorityIntern
money$35/hr - $42/hr
workcardStart in 2026 Summer

TSMC is a leading dedicated semiconductor foundry seeking a Design Flow and Automation Engineer Intern for Summer 2026. The intern will work with the Design Flow Signoff team, focusing on tools for implementation, timing, and power modeling, while gaining hands-on experience in a hybrid work environment.

Consumer ElectronicsElectronicsManufacturingProduct DesignSemiconductor
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H1B Sponsor Likelynote

Responsibilities

Report directly to the Director of the Design Flow Signoff Department
Work with a broad range of tools, including implementation, timing/EM/IR/power modeling, and analysis

Qualification

PythonC/C++EDA toolsMachine learningDigital design flowsData wranglingUnixDeep learningFoundation modelsReinforcement learningStandard cells understanding

Required

Currently working towards a M.S. or Ph.D. in Electrical Engineering (or other Engineering fields with a strong mathematics/statistics background, or a related AI field)
Python, C/C++, Unix experience required
Experience with EDA tools for circuit simulation, timing analysis and library characterization
Experience with data wrangling, pre-processing, and extraction from structured and unstructured data sources
Experience with classical machine learning, deep learning, foundation models, to develop data-driven solutions

Preferred

Proficiency with digital design flows, especially signoff flows also desirable
Understanding of how digital devices and standard cells work
Understanding of reinforcement learning, Large Language Models

Company

TSMC

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Established in 1987, TSMC is the world's first dedicated semiconductor foundry.
dateFounded in 1987
location
Hsinchu, T'ai-wan, TWN
people-size10001+ employees
web-link
http://www.tsmc.com

H1B Sponsorship

TSMC has a track record of offering H1B sponsorships. Please note that this does not guarantee sponsorship for this specific role. Below presents additional info for your reference. (Data Powered by US Department of Labor)
Distribution of Different Job Fields Receiving Sponsorship
Represents job field similar to this job
Trends of Total Sponsorships
2025 (49)
2024 (27)
2023 (30)
2022 (17)
2021 (31)
2020 (35)

Funding

Current Stage
Public Company
Total Funding
$14.2B
Key Investors
U.S. Department of CommerceBerkshire Hathaway
2024-04-08Grant· $6.6B
2024-01-01Acquired
2022-09-30Post Ipo Equity· $4.1B

Leadership Team

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Morris Chang
Founder, Chairman & CEO
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Peter M. Cleveland
Senior Vice President
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Recent News

Channel NewsAsia
Taiwan looks forward to more chip investment in Arizona, president says
2026-01-23
Benzinga.com
Taiwan Semiconductor's Advanced Chip Shift To US Might Be Insignificant: Report
2026-01-22
Benzinga.com
Nvidia Dethrones Apple As Taiwan Semiconductor's Largest Customer
2026-01-22
Company data provided by crunchbase