Summer 2026 - Design Flow and Automation Engineer Intern (7263) jobs in United States
cer-icon
Apply on Employer Site
company-logo

TSMC · 1 month ago

Summer 2026 - Design Flow and Automation Engineer Intern (7263)

positionAustin, TX
timeInternship
remoteHybrid
seniorityIntern
money$35/hr - $42/hr
workcardStart in 2026 Summer

TSMC is a leading dedicated semiconductor foundry, and they are seeking a Design Flow and Automation Engineer Intern for Summer 2026. The intern will work with the Design Flow Signoff team, focusing on tools related to implementation, timing modeling, and analysis.

Consumer ElectronicsElectronicsManufacturingProduct DesignSemiconductor
check
H1B Sponsor Likelynote

Qualification

PythonC/C++UnixEDA toolsDigital design flowsMachine learningData wranglingDeep learningReinforcement learningLarge Language Models

Required

Currently working towards a M.S. or Ph.D. in Electrical Engineering (or other Engineering fields with a strong mathematics/statistics background, or a related AI field)
Python, C/C++, Unix experience required
Experience with EDA tools for circuit simulation, timing analysis and library characterization
Experience with data wrangling, pre-processing, and extraction from structured and unstructured data sources
Experience with classical machine learning, deep learning, foundation models, to develop data-driven solutions

Preferred

Proficiency with digital design flows, especially signoff flows also desirable
Understanding of how digital devices and standard cells work
Understanding of reinforcement learning, Large Language Models

Company

TSMC

twittertwittertwitter
Glassdoor3.1
company-logo
Established in 1987, TSMC is the world's first dedicated semiconductor foundry.
dateFounded in 1987
location
Hsinchu, T'ai-wan, TWN
people-size10001+ employees
web-link
http://www.tsmc.com

H1B Sponsorship

TSMC has a track record of offering H1B sponsorships. Please note that this does not guarantee sponsorship for this specific role. Below presents additional info for your reference. (Data Powered by US Department of Labor)
Distribution of Different Job Fields Receiving Sponsorship
Represents job field similar to this job
Trends of Total Sponsorships
2025 (49)
2024 (27)
2023 (30)
2022 (17)
2021 (31)
2020 (35)

Funding

Current Stage
Public Company
Total Funding
$14.2B
Key Investors
U.S. Department of CommerceBerkshire Hathaway
2024-04-08Grant· $6.6B
2024-01-01Acquired
2022-09-30Post Ipo Equity· $4.1B

Leadership Team

leader-logo
Morris Chang
Founder, Chairman & CEO
leader-logo
Peter M. Cleveland
Senior Vice President
linkedin

Recent News

Benzinga.com
Taiwan Semiconductor Soars Past $1.6 Trillion As Big Tech Scrambles for Chip Capacity
2026-01-07
Benzinga.com
Spotlight on Taiwan Semiconductor: Analyzing the Surge in Options Activity
2026-01-06
Benzinga.com
Why Is Taiwan Semiconductor Stock Gaining Tuesday?
2026-01-06
Company data provided by crunchbase