Broadcom · 3 days ago
Chip Architect - ARM-based SoC Design (Sensing & Touch, Ultra-Low Power)
San Jose, CA
Full-time
Onsite
Senior Level, Lead/Staff
$141K/yr - $226K/yr
10+ years expBroadcom is seeking a highly skilled and experienced Chip Architect to lead the definition and documentation of next-generation ARM-based Systems-on-Chip (SoCs). The role focuses on bridging the gap between system requirements and silicon implementation, emphasizing mixed-signal integration for sensing and touch interfaces within stringent low-power constraints.
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Responsibilities
Lead comprehensive power and bandwidth analysis for architectural trade-offs
Develop models to predict system performance and power consumption (uW/MHz) and make data-driven decisions to optimize the SoC PPA (Power, Performance, Area)
Create and maintain detailed chip specification documentation, including detailed architecture descriptions, relevant block diagrams, timing diagrams, and expected waveforms to guide implementation and verification teams
Define and drive the top-level architecture for complex SoCs utilizing various ARM processor cores (Cortex-M, Cortex-A, etc.) and associated system IP
Ensure the architecture is easily programmable and meets real-time constraints
Provide clear specifications and support during implementation
Translate high-level use cases into concrete architectural requirements
Define clear interfaces and integration strategies for mixed-signal blocks
Architect the seamless integration of mixed-signal components tailored for advanced sensing and touch applications
Champion ultra-low-power design methodologies and architectural choices to achieve aggressive battery life targets for portable devices
Qualification
Required
Bachelor's and 12+ years of related experience, or Master's degree in Electrical Engineering, Computer Engineering, or a related field and 10+ years of related experience
System engineering, or a related field, with a proven track record of successful SoC tape-outs
Deep expertise in ARM architectures and system IP (interconnects, memory systems)
Proven experience conducting rigorous power (static/dynamic) and bandwidth analysis for complex systems
Strong understanding of mixed-signal integration challenges and design principles for sensing/touch applications
Excellent technical writing skills with meticulous attention to detail in creating specifications, diagrams, and documentation
Exceptional communication, leadership, and negotiation skills
Must be highly effective at driving consensus and clarity across disparate engineering disciplines
This is a full-time, hands-on role that requires the employee to be present at the office location. There is no remote work option available
Preferred
Touch Sensors
Mixed Signal SOC architecture
FPGA knowledge is a plus
Low power Architecture as applied to DSP
Technical Customer engagement
Benefits
Medical, dental and vision plans
401(K) participation including company matching
Employee Stock Purchase Program (ESPP)
Employee Assistance Program (EAP)
Company paid holidays
Paid sick leave
Vacation time
Paid Family Leave and other leaves of absence
Company
Broadcom
Broadcom is a designer, developer, and global supplier of a broad range of analog and digital semiconductor connectivity solutions.
10001+ employees
H1B Sponsorship
Broadcom has a track record of offering H1B sponsorships. Please note that this does not
guarantee sponsorship for this specific role. Below presents additional info for your
reference. (Data Powered by US Department of Labor)
Distribution of Different Job Fields Receiving Sponsorship
Represents job field similar to this job
Trends of Total Sponsorships
2025 (92)
2024 (77)
2023 (79)
2022 (112)
2021 (110)
2020 (89)
Funding
Current Stage
Public CompanyTotal Funding
unknown2017-10-31Post Ipo Equity
2015-05-28Acquired
1998-04-17IPO
Leadership Team
Greg Singh
CTO for APJ, Enterprise Security Group
Kirsten Spears
CFO and CAO, Broadcom
Recent News
2026-01-07
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