pSemi, A Murata Company · 4 hours ago
Technical Director, NPI Packaging Technology and Assembly Engineering
San Diego, CA
Full-time
Onsite
Director/Executive
$187K/yr - $258K/yr
15+ years exppSemi Corporation, a Murata company, is focused on driving semiconductor integration to enhance its capabilities with high-performance semiconductors. The Technical Director, NPI Packaging Technology and Assembly Engineering will lead a team to develop and implement packaging and assembly processes, collaborating closely with design teams to bring innovative wireless products to market.
Electrical DistributionManufacturingSemiconductor
Responsibilities
Lead and manage small teams of packaging and layout engineers
Develop a package and assembly roadmap to meet pSemi business unit goals in collaboration with the operations packaging team
Lead and collaborate with Design & Operations to develop differentiating packaging standards and flows
Work closely with the IC design teams on pSemi NPI project package technology, package design, and package selection
Work with the EM and layout teams to enable standards and drive best practices across the company
Work collaboratively as required with Operations for vendor & technology selection, cost analysis, qualification, production ramp, and RMA investigation of bumped and packaged products manufactured at pSemi off-shore assembly subcontractors
Advise management on roadmap for new suppliers to meet pSemi Business Unit and Operations team goals
Drive continuous improvement in design for cost and more aggressive design rule implementation
Participate in technical audits of vendors and subcontractors in collaboration with Operations
Qualification
Required
Minimum of 15 years of experience in semiconductor packaging and assembly process development
8 years of management experience
Strong written and verbal communication skills
Ability to manage multiple complex, high visibility projects in parallel
Expertise with assembly process development, characterization and qualification for advanced high volume manufacturing processes
Experience with wafer bumping, singulation, wirebond and flip chip assembly, organic laminate and ceramic substrate technology, Wafer Level CSP (WLCSP), System in Package (SIP), embedded die technology, and lead frame packaging
Experience with package design tools such as Autocad, Cadence Allegro / APD, Zuken
Experience generating assembly and package drawings for vendors, customers, and data sheets
Knowledgeable about package electrical / thermal / stress modeling and characterization
Knowledgeable about RF and power dissipation as it relates to packaging requirements
Experience generating customer application notes and supporting RMA investigations
Bachelor's degree in Mechanical, Chemical, Electrical Engineering, Materials Science or Physics
Preferred
Strong working knowledge and experience working with Asian subcontract bump and assembly suppliers
Familiarity with EM concepts and techniques for optimizing impedances, ground inductances, and isolation
Familiarity with EMI concepts and modeling techniques
Demonstrated ability to use statistical analysis tools (such as JMP) and concepts, including proficiency in formal Design of Experiment methodology applied to process development
Company
pSemi, A Murata Company
pSemi Corporation is a Murata company driving semiconductor integration.
501-1000 employees
H1B Sponsorship
pSemi, A Murata Company has a track record of offering H1B sponsorships. Please note that this does not
guarantee sponsorship for this specific role. Below presents additional info for your
reference. (Data Powered by US Department of Labor)
Distribution of Different Job Fields Receiving Sponsorship
Represents job field similar to this job
Trends of Total Sponsorships
2025 (22)
2024 (30)
2023 (28)
2022 (38)
2021 (40)
2020 (36)
Funding
Current Stage
Public CompanyTotal Funding
$92.1MKey Investors
Morgenthaler Ventures
2014-08-22Acquired
2012-08-08IPO
2004-11-02Series Unknown· $17.6M
Leadership Team
Mark L. Burgener, Ph.D.
Co-founder
Keith Bargroff
senior vice president, engineering and technology
Recent News
GlobeNewswire News Room
2025-07-08
Company data provided by crunchbase