Celestial AI · 1 day ago
2.5D/3D Process Development Engineer
Santa Clara, CA
Full-time
Onsite
Senior Level, Lead/Staff
$195K/yr - $235K/yr
10+ years expCelestial AI is a cutting-edge company focused on advancing AI technologies through innovative interconnect solutions. The 2.5D/3D Process Development Engineer will leverage their expertise in process engineering to manage the development of assembly processes, ensuring high volume manufacturing and reliability of new technologies.
Semiconductors
Responsibilities
Work with cross-functional packaging teams and lead process development at foundry along with 2.5D/3D CoW process development with particular emphasis on chemistry development with packaging consumable suppliers at OSATs to bring packaging solutions from concept to prototypes and ramp to high volume manufacturing with aggressive cost reduction strategies
Actively manage qualification of packages with sensitivity to physics of failures for high thermo-mechanical reliability, while operating within established cost constraints
Manage internal and external resources effectively and efficiently towards established corporate milestones
Drive ideation and innovation of advanced package solutions and specifications with vendors to advance productization efforts by Celestial AI
Qualification
Required
10+ years of experience in Semiconductor Packaging, Process and Technology Development
Expert level understanding of advanced foundry process node and its interaction with Packaging/assembly/substrate across various package technologies is required
Expertise in advanced packaging technologies: knowledge and insight to deliver high density/high performance interconnects with TSVs in various 2.5D/3D package form factors
Proven track record of bringing products from Technology development, package design/definition, qualification, NPI through HVM is required
Working level understanding of cross-functional packaging areas: package architecture, design rules, BOM, enabling material/process technologies, mechanical, design for manufacturing, reliability, and cost
Familiarity with component & system level reliability, testing, and FA
Experience in project management and communicating technical and project/program status and issue resolution at the executive level
Excellent problem-solving skills with strong fundamentals in science, sound engineering judgment, and analytical ability
Effective communicator and comfortable engaging with internal cross functional teams as well as domestic and overseas suppliers
Excellent attention to detail, process and operationally oriented and self-driven with the ability to work independently and take projects to completion with minimum supervision
M.S or Ph.D. in Chemical Engineering, Materials Science, Mechanical Engineering, Chemistry or Physics is required
Preferred
Experience with photonics packaging
Benefits
Health, vision, dental and life insurance
Collaborative and continuous learning work environment
Company
Celestial AI
AI is touching our lives and driving breakthroughs in healthcare, finance, autonomous systems, and countless other domains.
51-200 employees
H1B Sponsorship
Celestial AI has a track record of offering H1B sponsorships. Please note that this does not
guarantee sponsorship for this specific role. Below presents additional info for your
reference. (Data Powered by US Department of Labor)
Distribution of Different Job Fields Receiving Sponsorship
Represents job field similar to this job
Trends of Total Sponsorships
2025 (15)
2024 (10)
2023 (4)
2022 (7)
2021 (1)
Funding
Current Stage
Growth StageLeadership Team
David Lazovsky
Founder, CEO
Recent News
Venture Capital Access Online
2025-03-13
2025-03-13
Company data provided by crunchbase