Sr. Application Engineer- Structures (Semiconductor/Electronics) jobs in United States
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Synopsys Inc · 3 days ago

Sr. Application Engineer- Structures (Semiconductor/Electronics)

Synopsys Inc is a leader in chip design and verification technology. The role involves leading technical activities in structural mechanics, collaborating with customers to deliver innovative simulation solutions, and enhancing product performance through expert guidance.

Electronic Design Automation (EDA)Information ServicesInformation TechnologySoftware
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H1B Sponsor Likelynote

Responsibilities

Lead all technical activities throughout the sales lifecycle, including technical discovery, negotiation of success criteria, product presentations, demonstrations, and evaluations
Act as a hands-on expert in structural mechanics, working directly with customers to understand and address their product development and simulation requirements
Utilize Ansys solutions and best practices to recommend improvements that enhance customers’ performance metrics and product designs
Support the development and integration of advanced simulation solutions into customer workflows, becoming a recognized subject matter expert in your field
Collaborate closely with Product Development teams to translate customer feedback into new product features, and participate in testing and validation of new releases
Create and deliver professional services, including training classes, workshops, and technical consulting to elevate customer productivity
Develop promotional materials and support marketing events, presenting at conferences to showcase Ansys capabilities and success stories

Qualification

FEA modelingAnsys MechanicalStructural mechanicsScripting languagesAI/ML algorithmsCommercial CAE softwareCommunication skillsOrganizational skillsProblem-solvingTeam player

Required

BS, MS, or PhD in Mechanical, Chemical, or Aerospace Engineering (required); advanced degrees preferred
Minimum 5 years (BS), 3 years (MS), or entry-level (PhD) experience in engineering software environments; 8+ years preferred
Proven expertise in FEA modeling of hi-tech/electronic packaging using Ansys Mechanical, LSDyna, or similar CAE tools
Strong fundamentals in structural and continuum mechanics
Demonstrated experience with commercial CAE, CAD, EDA, or PLM software packages
Basic understanding of AI/ML algorithms and their application in engineering projects
Proficiency in scripting languages such as Python or C++
Ability to travel up to 25-50% domestically as required

Preferred

Advanced degrees preferred
8+ years preferred

Benefits

Health, wellness, and financial benefits

Company

Synopsys Inc

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Synopsys is the leader in engineering solutions from silicon to systems, enabling customers to rapidly innovate AI-powered products.

H1B Sponsorship

Synopsys Inc has a track record of offering H1B sponsorships. Please note that this does not guarantee sponsorship for this specific role. Below presents additional info for your reference. (Data Powered by US Department of Labor)
Distribution of Different Job Fields Receiving Sponsorship
Represents job field similar to this job
Trends of Total Sponsorships
2025 (177)
2024 (216)
2023 (158)
2022 (204)
2021 (215)
2020 (190)

Funding

Current Stage
Public Company
Total Funding
$2B
Key Investors
NVIDIAGreen Pine Capital Partners
2025-12-01Post Ipo Equity· $2B
2022-09-21Post Ipo Equity
1994-01-01Post Ipo Equity

Leadership Team

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Aart Geus
Co-Founder, Chairman & CEO
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Chi-Foon Chan
President and co-Chief Executive Officer
Company data provided by crunchbase