Marvell Technology · 2 days ago
Advanced Packaging, SI/PI Principal Engineer
Westborough, MA
Full-time
Onsite
Lead/Staff
$148K/yr - $220K/yr
8+ years expMarvell Technology is a leading provider of semiconductor solutions essential for data infrastructure. The Advanced Packaging team is responsible for package design and technology development, focusing on signal integrity and power integrity for high-performance computing and AI solutions.
DSPInternet of ThingsManufacturingSemiconductorWireless
Hiring Manager
Magda Melena
Responsibilities
SI/PI analysis of designs and optimization within 2D/2.5D/3D packages
Interfacing with product design teams and clients for optimized floor-planning, package substrate design, and power delivery network design
Perform wiring studies in order to determine optimal signal routing, power delivery verification and package size determination
Training and mentoring within a growing team of Signal and Power Integrity engineers
Qualification
Required
A knowledge of Electrical Engineering concepts, circuit extractions and simulation, as well as design methodology and strategies is required
Bachelor's degree in electrical engineering or related fields and 10+ years of related professional experience in package or PCB design, or master's degree and/or PhD in Electrical Engineering with coursework in signal integrity and power delivery and 8+ years of experience
Understanding of signal integrity and power integrity concepts and fundamentals
Experience in package development, including interposer design
Experience with EDA simulation tools such as Ansys HFSS, Keysight ADS, Cadence Sigrity tools
Familiarity with packaging technologies, materials, package substrate design rules and assembly rules
Experience with simulation and analysis using tools like PowerSI, SIwave
Working knowledge of circuit extractions and simulations
Ability to work with engineers in multiple locations and geographies
Strong communication, presentation and documentation skills
Preferred
People and/or team leadership is a strong plus
Board and system level signal and power integrity analysis
Good understanding of interposer, substrate, package, PCB level design rules, ability to perform routing feasibility studies using Cadence APD or PCB editor
Understanding of signal and power integrity for 2.5D/3D packages including (a) CoWoS-S/R/L, (b) EMIB, (c) CPO, (d) CPC
Ability to manage programs involving cross-functional teams
Strong interpersonal skills and willingness to learn new things are necessary along with the ability to work with stakeholders in multiple time zones across the globe
Interested in being a leader in growing team
Benefits
Flexible time off
401k
Year-end shutdown
Floating holidays
Paid time off to volunteer
Company
Marvell Technology
We believe that infrastructure powers progress. That execution is as essential as innovation. That better collaboration builds better technology.
5001-10000 employees
H1B Sponsorship
Marvell Technology has a track record of offering H1B sponsorships. Please note that this does not
guarantee sponsorship for this specific role. Below presents additional info for your
reference. (Data Powered by US Department of Labor)
Distribution of Different Job Fields Receiving Sponsorship
Represents job field similar to this job
Trends of Total Sponsorships
2025 (242)
2024 (186)
2023 (154)
2022 (210)
2021 (210)
2020 (165)
Funding
Current Stage
Public CompanyTotal Funding
unknown2017-01-20Post Ipo Equity
2016-05-13Post Ipo Equity
2015-02-05Acquired
Leadership Team
Matthew Murphy
Chairman and CEO
Radha Nagarajan
SVP & CTO, Optical Engineering
Recent News
Inside HPC & AI News | High-Performance Computing & Artificial Intelligence
2026-01-09
Tech Startups - Tech News, Tech Trends & Startup Funding
2026-01-07
2026-01-07
Company data provided by crunchbase