Sr. Ceramic Packaging Engineer jobs in United States
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EngeniusMicro · 1 month ago

Sr. Ceramic Packaging Engineer

EngeniusMicro is a hardware focused small business providing research and development engineering services to industry and the Federal Government. The Sr. Ceramic Packaging Engineer will work on developing and refining ceramic materials and processes for electronic device packaging, ensuring performance and reliability through testing and analysis.

AerospaceElectronicsSensor
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Growth Opportunities

Responsibilities

Work with 3D printed ceramic material to create layouts and plan for electrical connections
Design interfaces and checks for thermal, electrical, and mechanical performance
Develop and refine the ceramic materials and processes used to create protective enclosures for electronic devices, such as semiconductors and microchips
Research and develop new ceramic materials with specific properties for packaging applications
Optimize and refine ceramic processing techniques, including sintering, slip casting, and additive manufacturing
Design and engineer ceramic packages, considering factors like heat transfer, electrical performance, and mechanical strength
Conduct testing and analysis to assess the performance and reliability of ceramic packages
Address and resolve issues related to ceramic material or processing during the manufacturing process
Ensure the integrity and functionality of the device's package, considering factors like heat dissipation, electrical insulation, and mechanical durability
Invent and write patent applications
Write or assist in writing funding proposals, manage funding expenses and prepare technical reports
Lead and train supporting technicians to carry out research work and guide scale-up processes
Work collaboratively with external RandD partners
Communicate experimental results and problems with supervisors

Qualification

PhD in Mechanical EngineeringCeramic materials developmentAdditive manufacturingThermal performance designMechanical strength analysisTechnical report writingTeam collaborationProblem-solvingLeadership

Required

PhD in Mechanical Engineering or a related field

Company

EngeniusMicro

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EngeniusMicro is developing wireless microsensors for communication protocols.

Funding

Current Stage
Early Stage
Total Funding
$0.37M
Key Investors
Innovate AlabamaNational Science Foundation
2023-08-09Grant
2022-08-30Grant
2013-11-13Grant· $0.22M

Leadership Team

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Michael Kranz
Owner/CEO, EngeniusMicro
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Company data provided by crunchbase