EngeniusMicro · 1 month ago
Sr. Ceramic Packaging Engineer
EngeniusMicro is a hardware focused small business providing research and development engineering services to industry and the Federal Government. The Sr. Ceramic Packaging Engineer will work on developing and refining ceramic materials and processes for electronic device packaging, ensuring performance and reliability through testing and analysis.
AerospaceElectronicsSensor
Responsibilities
Work with 3D printed ceramic material to create layouts and plan for electrical connections
Design interfaces and checks for thermal, electrical, and mechanical performance
Develop and refine the ceramic materials and processes used to create protective enclosures for electronic devices, such as semiconductors and microchips
Research and develop new ceramic materials with specific properties for packaging applications
Optimize and refine ceramic processing techniques, including sintering, slip casting, and additive manufacturing
Design and engineer ceramic packages, considering factors like heat transfer, electrical performance, and mechanical strength
Conduct testing and analysis to assess the performance and reliability of ceramic packages
Address and resolve issues related to ceramic material or processing during the manufacturing process
Ensure the integrity and functionality of the device's package, considering factors like heat dissipation, electrical insulation, and mechanical durability
Invent and write patent applications
Write or assist in writing funding proposals, manage funding expenses and prepare technical reports
Lead and train supporting technicians to carry out research work and guide scale-up processes
Work collaboratively with external RandD partners
Communicate experimental results and problems with supervisors
Qualification
Required
PhD in Mechanical Engineering or a related field
Company
EngeniusMicro
EngeniusMicro is developing wireless microsensors for communication protocols.