MFG & PROCESS DVL ENGINEER II (On-Site) jobs in United States
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TE Connectivity · 1 month ago

MFG & PROCESS DVL ENGINEER II (On-Site)

TE Connectivity is a global industrial technology leader creating a safer, sustainable, productive and connected future. The Development Engineer is responsible for providing economical solutions to improve manufacturing processes for wire and cable, while collaborating with various teams to support product development and ensure quality standards.

AutomotiveElectrical DistributionHardwareManufacturingSoftware
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H1B Sponsor Likelynote

Responsibilities

Process Development/Implementation/Documentation – Tape, Cable, Braid
Assist other areas of cable manufacturing as required
Support Product Development/Design Engineering activities
Interact with test lab on process/product qualification activities – DOE, PFMEA, 8D, FA
Tooling Specification & Design
Product / Process Validation & Transfer
Support additional manufacturing sites
Manufacturing Equipment Specification & Design – concept, qualification, FAT
Interact with industry OEM equipment, material, and tooling develop and improve performance/ quality/supply
Support SAFE Activities
Support ISO Activities
Provide Technical support for maintenance activities

Qualification

Process DevelopmentWire & Cable EngineeringSPC/Six Sigma/LeanCAD ExperienceIndustrial Drives & ControlsProduct/Process Validation

Required

Minimum 5 years of wire & cable process engineering experience
Working Knowledge in SPC/Six Sigma/Lean
CAD Experience Required
Knowledge of materials, processes, and systems used in the manufacture of wire & cable
30% International Travel Required

Preferred

Manufacturing, Mechanical or Plastics Engineering Degree
Knowledge of industrial drives & controls including ladder logic

Benefits

A comprehensive benefits package including health insurance
401(k)
Disability
Life insurance
Employee stock purchase plan
Paid time off
Voluntary benefits

Company

TE Connectivity

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TE Connectivity provides and markets engineered electronic components, network solutions, and specialty products.

H1B Sponsorship

TE Connectivity has a track record of offering H1B sponsorships. Please note that this does not guarantee sponsorship for this specific role. Below presents additional info for your reference. (Data Powered by US Department of Labor)
Distribution of Different Job Fields Receiving Sponsorship
Represents job field similar to this job
Trends of Total Sponsorships
2025 (85)
2024 (75)
2023 (103)
2022 (93)
2021 (81)
2020 (76)

Funding

Current Stage
Public Company
Total Funding
$3.1B
2025-04-29Post Ipo Debt· $1.47B
2025-01-28Post Ipo Debt· $782.37M
2024-07-30Post Ipo Debt· $350M

Leadership Team

T
Terrence R. Curtin
Chief Executive Officer
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Heath A. Mitts
Chief Financial Officer
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Company data provided by crunchbase