SR MGR R&D/PRODUCT DVL ENGINEERING jobs in United States
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TE Connectivity · 1 month ago

SR MGR R&D/PRODUCT DVL ENGINEERING

TE Connectivity is a leader in the connector, cable assembly, and radio system industry. The Senior Manager of Product Development Engineering will lead a team of signal integrity engineers in designing high-speed products, ensuring performance and functional requirements are met while fostering innovation and employee well-being.

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H1B Sponsor Likelynote

Responsibilities

Manage and lead a team of regional/global signal integrity engineers in establishing signal integrity design performance and functional requirements for new products
Lead the team to perform signal integrity simulations for multiple high-speed standards on each product. This includes determining the correct simulation methodology and setup to use, as well as a good understanding of the criteria for each interface
Guide the team in connector design and qualifications from a signal integrity standpoint with a focus on making data-driven decisions about the product functionality and areas for improvement
Create actionable recommendations based upon design reviews and simulation results
Lead the team in communicating actions and impacts clearly to stakeholders including management, customers, and the technical community
Align the technology roadmap with the market trends, customer needs, and implement accordingly
Drive a culture of innovation using a base of traditional approaches and external knowledge to develop innovative solutions
Effectively lead a regional/global team of SI engineers of varying levels of experience with different backgrounds, experiences, and cultures
Drive high performance by providing your team routine coaching and feedback, holding your team accountable to meet performance objectives, and providing meaningful development to increase individual/team capability
Manage employee well-being by prioritizing work, effectively managing resource loading, and providing flexibility to enable employees to successfully balance their work and personal lives
Drive organization effectiveness by structuring your organization in a way that best enables the BU strategy, maximizes resource efficiency and productivity, and provides role clarity and clear lines of accountability
Manage the talent in your organization to support the business now and to proactively prepare for the future by identifying organization skillset/role gaps, implementing plans to fill any skillset/role gaps, and assessing current talent fit to ensure the right talent is matched to the right roles to best meet the needs of the business

Qualification

Signal integrity analysis toolsElectromagnetic theoryHigh-speed test equipmentInterconnect design3D CAD toolsPCB layoutData analysis techniquesPhysical layer communicationsChange managementContinuous improvementFluent in EnglishTeam leadership

Required

Bachelor's degree in Electrical Engineering or equivalent work experience
Generally requires 13 years of relevant work experience in electrical Design, RF design or PCB design
Generally requires a minimum of 5 years of progressive leadership and people management experience in a global environment
A solid understanding of electromagnetic theory and electrical circuit behavior
Expert with Signal integrity analysis tools (Agilent ADS, Ansys HFSS, CST, or equivalent tools)
Proficient with 3D CAD tools (AutoCAD, Creo, or equivalent)
Proficient with high-speed test equipment (VNA, TDR, BERT)
Proficient with interconnect design or electronic packaging, with a preferred focus on high-speed differential connectors and/or cable assemblies, RF connectors, and channel integration
Proficient with printed circuit board layout and design, fabrication and assembly, especially as associated with connector FP and card-edge interfaces
Proficient with data analysis techniques, appreciation for design geometry tolerance impacts, and HVM qualification
Practiced analytical capabilities to interpret simulation and lab data to identify issues and provide solutions to fix identified problem
Experience with physical layer communications systems and architectures
Fluent in English (both verbal and written)
Ability to work in a global environment – able to accommodate varying time zones and capable of collaborating with individuals across geographies
Master problem solver – able to solve unusually high complexity situations with little to no direction
Pro-active in identifying complex issues, providing solutions, and driving improvements to evolve procedures
Advanced capability in presenting technical solutions to customers and upper management
Demonstrated experience leading/developing a team of 10+ experienced professionals who exercise latitude and independence in their assignments with accountability for team/department performance, project delivery, and resource allocation
Advanced capability in building and leading a high-performing team - experienced in assessing talent fit (current team and future hires), aligning skills to business needs, identifying skillset gaps needed to strengthen the team, identifying organizational gaps creating barriers, and taking the necessary actions to maintain a high-performing team
Demonstrated experience and accountability for establishing and ensuring adherence to budgets, schedules, and work plans
Advanced capability in leading cross-functional new product development projects which require strong collaboration and influencing skills to achieve the right outcome for the business
Advanced capability in driving a data analytics mindset across the team – identifying the most meaningful data to collect, analyzing it, drawing conclusions, and presenting those conclusions as data intelligence to provide insight and drive innovative solutions for the business
Advanced capability in leading change in a high-paced and dynamic environment with an understanding of common barriers to effectively managing change
Advanced continuous improvement skillset with demonstrated experience implementing best practices to enhance engineering efficiency

Preferred

Master's Degree
SpaceClaim preferred
Altium preferred

Company

TE Connectivity

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TE Connectivity provides and markets engineered electronic components, network solutions, and specialty products.

H1B Sponsorship

TE Connectivity has a track record of offering H1B sponsorships. Please note that this does not guarantee sponsorship for this specific role. Below presents additional info for your reference. (Data Powered by US Department of Labor)
Distribution of Different Job Fields Receiving Sponsorship
Represents job field similar to this job
Trends of Total Sponsorships
2025 (85)
2024 (75)
2023 (103)
2022 (93)
2021 (81)
2020 (76)

Funding

Current Stage
Public Company
Total Funding
$3.1B
2025-04-29Post Ipo Debt· $1.47B
2025-01-28Post Ipo Debt· $782.37M
2024-07-30Post Ipo Debt· $350M

Leadership Team

T
Terrence R. Curtin
Chief Executive Officer
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Heath A. Mitts
Chief Financial Officer
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Company data provided by crunchbase