TE Connectivity · 2 months ago
TEMPORARY ASSEMBLY OPERATOR I 1
TE Connectivity is a global industrial technology leader creating a safer, sustainable, productive, and connected future. The Assembly Operator I role involves assembling sensors using lead soldering and light tig welding, troubleshooting components to meet quality standards, and maintaining a clean work environment.
AutomotiveElectrical DistributionHardwareManufacturingSoftware
Responsibilities
Follow standardized work instructions for the printing and assembly of components in accordance with component level drawings
Demonstrate soldering and some light tig welding skills
Read and comprehending manufacturing drawings regarding printing sheets for production
Ensure high cleanliness standards are maintained during printing and component assembly
Ensure first time assembly success and minimizing material waste attributed to manufacturing workmanship
Demonstrate a mindset of continuous improvement in all duties
Other duties as assigned by Team Leader
Qualification
Required
1 year minimum role in manufacturing preferably pertaining to soldering and assembly components
High school diploma or GED
A degree or certification as a Mechatronics/electronics technician
Comply with applicable quality assurance standards
Preferred
Minimum 2 years of manufacturing experience related preferred
Benefits
Health insurance
401(k)
Disability
Life insurance
Employee stock purchase plan
Paid time off
Voluntary benefits
Company
TE Connectivity
TE Connectivity provides and markets engineered electronic components, network solutions, and specialty products.
H1B Sponsorship
TE Connectivity has a track record of offering H1B sponsorships. Please note that this does not
guarantee sponsorship for this specific role. Below presents additional info for your
reference. (Data Powered by US Department of Labor)
Distribution of Different Job Fields Receiving Sponsorship
Represents job field similar to this job
Trends of Total Sponsorships
2025 (85)
2024 (75)
2023 (103)
2022 (93)
2021 (81)
2020 (76)
Funding
Current Stage
Public CompanyTotal Funding
$3.1B2025-04-29Post Ipo Debt· $1.47B
2025-01-28Post Ipo Debt· $782.37M
2024-07-30Post Ipo Debt· $350M
Recent News
2026-01-22
Business News Americas
2026-01-20
Company data provided by crunchbase