TE Connectivity · 1 month ago
Principal Optical System Architect (Remote)
United States
Full-time
Remote
Senior Level, Lead/Staff
$154K/yr - $231K/yr
12+ years expTE Connectivity is a company focused on creating a safer, sustainable, and more connected world. The Principal Optical System Architect will drive the next generation of technology innovations in optical connectivity, focusing on product development and strategic initiatives within the Digital Data Networks Business Unit.
AutomotiveElectrical DistributionHardwareManufacturingSoftware
Responsibilities
Serve as the primary technical liaison for TE’s customers, actively engaging with hyperscalers, OEMs, and system architects to gain deep insights into next-gen compute, AI, storage, and networking challenges
Proactively identify and assess technology disruptors, translating emerging trends into strategic R&D initiatives and product development roadmaps to maintain TE’s industry leadership
Cultivate and strengthen customer partnerships, fostering co-development opportunities and collaborative innovation to accelerate next-gen infrastructure advancements
Drive thought leadership by educating and influencing internal and external stakeholders, from executives and product teams to key decision-makers in customer organizations, on emerging industry trends, TE’s technical capabilities, and high-value engineering solutions
Bridge the gap between customer needs and TE’s technology roadmap, ensuring TE delivers future-proof, scalable, and high-performance interconnect solutions tailored to the evolving datacenter landscape
Define high-level system architecture requirements, ensuring TE’s product roadmap is aligned with next-generation compute, AI, and networking ecosystems
Drive TE’s technology vision and strategy, ensuring our interconnect solutions support the evolving needs of standards like OSFP, QSFP-DD, COBO, and standards set by OIF and IEEE, particularly as they relate to AI/ML workloads and next-generation data center architectures
Lead the evaluation of high-speed electrical, optical, and hybrid interconnect solutions, balancing performance, power, latency, cost, and manufacturability
Collaborate with internal R&D, product development, and business units to shape product development roadmaps based on real-world customer challenges and market trends
Drive technical due diligence for potential partnerships, acquisitions, and ecosystem collaborations, ensuring TE stays at the forefront of innovation
Drive the design and system architecture of co-packaged optics (CPO) or near-packaged (NPO) solutions, integrating optical interconnects tightly with high-radix ASIC subsystems to enable ultra-high bandwidth and low-latency data transmission
Define novel, scalable CPO/NPO architectures to meet future performance, power, and density demands of AI, ML, and hyperscale workloads
Architect CPO/NPO systems across optical, electrical, thermal, and mechanical domains
Conduct end-to-end simulations and modeling to optimize signal integrity, power efficiency, and thermal performance
Evaluate emerging materials, photonic integration techniques, and semiconductor technologies to maintain a competitive advantage in CPO/NPO innovation
Represent TE in customer discussions and industry forums as a subject matter expert in co-packaged optics
Collaborate with hyperscalers, OEMs, and ecosystem partners to influence and align around roadmap development and optical interface standards
Partner with ASIC, package, board, and photonics engineering teams to ensure CPO/NPO solutions are manufacturable, scalable, and aligned with system architecture requirements
Work cross-functionally with engineering, product management, sales, and marketing teams to translate technical insights into compelling product offerings
Drive the execution of high-impact, innovative technical projects, ensuring seamless alignment between customer needs, business goals, and engineering capabilities
Guide TE’s go-to-market strategy for new interconnect solutions, ensuring that our technical differentiation is clearly communicated and leveraged in competitive landscapes
Qualification
Required
Bachelor's degree or higher in Optical Engineering, Electrical Engineering, Mechanical Engineering, or Physics with 12+ years' experience in the optical design
Technical expertise in high-speed optical engineering and design
Knowledge of compute, networking, AI / ML, and storage architectures
Experience in data center compute and/or networking industry system design and related technologies
Hands-on experience in the design and testing of optical transceivers and optical components
Silicon Photonics background is HIGHLY desired
Effectively able to build relationships with external customers and industry leaders as well as internally across all levels, disciplines, and geographies
Strategic minded with a proven ability to translate industry and technical trends into meaningful strategies for the business
Outstanding communication and presentation skills
A convincing communicator with compelling perspectives that drive engagement and excitement both up and down the organization, with an ability to clearly communicate technical concepts to diverse audiences
Demonstrates sound judgment in working through complex technical issues with an ability to communicate actions and impact clearly to stakeholders, including management, customers, and the technical community
Ability to spend 25%-50% of your time traveling domestically and internationally
Benefits
Total Compensation = Base Salary + Incentive(s) + Benefits
Company
TE Connectivity
TE Connectivity provides and markets engineered electronic components, network solutions, and specialty products.
10001+ employees
H1B Sponsorship
TE Connectivity has a track record of offering H1B sponsorships. Please note that this does not
guarantee sponsorship for this specific role. Below presents additional info for your
reference. (Data Powered by US Department of Labor)
Distribution of Different Job Fields Receiving Sponsorship
Represents job field similar to this job
Trends of Total Sponsorships
2025 (85)
2024 (75)
2023 (103)
2022 (93)
2021 (81)
2020 (76)
Funding
Current Stage
Public CompanyTotal Funding
$3.1B2025-04-29Post Ipo Debt· $1.47B
2025-01-28Post Ipo Debt· $782.37M
2024-07-30Post Ipo Debt· $350M
Leadership Team
T
Terrence R. Curtin
Chief Executive Officer
Heath A. Mitts
Chief Financial Officer
Recent News
2025-11-14
Company data provided by crunchbase