TE Connectivity · 1 month ago
STAFF R&D/PRODUCT DVL ENGINEER- ME COE
TE Connectivity is a global leader in connectivity and sensors, and they are seeking a Staff Mechanical Product Development Engineer to lead advanced mechanical research and design for interconnect systems. The role involves developing mechanical structures, executing simulations, and collaborating with cross-functional teams to enhance product performance and reliability.
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Responsibilities
Drive development of advanced mechanical platforms for interconnect systems, including housings, latches, thermal solutions, and structural supports
Lead thermomechanical simulation (FEA/CFD) activities to optimize mechanical performance, thermal management, and structural integrity
Translate real-world mechanical challenges into FEA models, using both implicit and explicit analysis methods to evaluate component behavior under different physical conditions (e.g., structural, thermal, vibration, shock)
Utilize advanced simulation tools such as Ansys Workbench, LS-DYNA, HyperMesh, Simufact, and Digimat to perform both linear and non-linear analyses and evaluate material and structural responses under diverse loading scenarios
Conduct root cause analysis and develop mitigation plans for mechanical challenges related to warpage, fatigue, insertion force, material failures, etc
Champion material and process innovation by evaluating composites, thermal interface materials (TIMs), and micro-structured mechanical designs
Create standardized mechanical modules for reuse across product families, aligned with design-for-manufacture and platforming strategies
Partner with manufacturing and tooling teams to ensure early DFM/DFA integration and fast prototyping of mechanical solutions
Develop and validate test plans for thermal cycling, vibration, shock, and environmental reliability
Generate and maintain design standards, mechanical guidelines, and mechanical review frameworks across TE D&D
Mentor junior engineers and support global mechanical design communities through technical forums, training, and documentation
Collaborate with CTO, AMP, and BU engineering teams to align on mechanical technology roadmaps and influence long-term innovation direction
Qualification
Required
Bachelor's degree in Mechanical Engineering or Physics with 8+ years of experience, or a Masters degree in Mechanical Engineering or Physics, or equivalent amount of experience in mechanical product development in connector, electronics, or high-reliability hardware industries
Hands-on experience with mechanical design and modeling using tools such as Creo, SolidWorks, or NX
Expertise in simulation tools such as ANSYS, Abaqus, or FloTHERM for thermal/structural analysis
Proven experience in DFM, DFA, and transition of mechanical designs to high-volume manufacturing
Deep understanding of materials science, including polymers, metals, and thermal materials
Experience conducting reliability testing: thermal cycling, vibration, drop/shock, and HALT/HASS
Strong problem-solving and analytical skills with a focus on root cause analysis and continuous improvement
Excellent communication skills to engage with global engineering, operations, and customer teams
Preferred
Experience with micro-mechanics, co-packaged optics, or liquid cooling solutions
Familiarity with data analytics, Six Sigma methodologies, or AI-driven simulation optimization
Experience working on system-level hardware such as AI servers, switches, or RF modules
Patent filings or published research in mechanical design, thermal management, or materials
Experience managing cross-functional or global engineering projects
Company
TE Connectivity
TE Connectivity provides and markets engineered electronic components, network solutions, and specialty products.
H1B Sponsorship
TE Connectivity has a track record of offering H1B sponsorships. Please note that this does not
guarantee sponsorship for this specific role. Below presents additional info for your
reference. (Data Powered by US Department of Labor)
Distribution of Different Job Fields Receiving Sponsorship
Represents job field similar to this job
Trends of Total Sponsorships
2025 (85)
2024 (75)
2023 (103)
2022 (93)
2021 (81)
2020 (76)
Funding
Current Stage
Public CompanyTotal Funding
$3.1B2025-04-29Post Ipo Debt· $1.47B
2025-01-28Post Ipo Debt· $782.37M
2024-07-30Post Ipo Debt· $350M
Recent News
2026-01-22
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2026-01-20
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