Sr. Thermal/Mechanical Field App Engineer jobs in United States
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Foxconn E BG Group · 1 month ago

Sr. Thermal/Mechanical Field App Engineer

Foxconn E BG Group is the world’s largest electronics manufacturer and leading provider of technological solutions. The Sr. Thermal/Mechanical Field Application Engineer serves as a technical lead and trusted advisor for enterprise and OEM customers, driving product integration and optimization while providing strategic technical support across design, validation, and post-deployment phases.

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H1B Sponsor Likelynote

Responsibilities

Serve as the primary technical interface for key customers across the Central and Southwest regions, providing in-depth system design, application guidance, and troubleshooting support
Lead product integration and validation efforts, including hardware and firmware testing, performance analysis, and field optimization
Partner with internal R&D and product management teams to translate customer requirements into design specifications and influence product enhancements
Conduct technical presentations, product demos, and customer training sessions for both engineering and executive audiences
Manage field issue resolution, coordinate root-cause analysis, and communicate corrective actions with internal and external stakeholders
Support business development activities, collaborating with sales teams to identify opportunities, define system solutions, and achieve design wins
Provide ongoing technical consultation and post-deployment support to sustain customer satisfaction and strengthen long-term relationships
Maintain awareness of industry trends, competitor products, and emerging technologies to advise internal teams on strategy and roadmap direction
Document technical findings, lessons learned, and recommendations for process and product improvement
Determine customer requirements (both explicit and implicit) and accurately communicate them back to key engineering team members
Drive product design development incorporating design rules, performance optimization and manufacturing for HVM (high volume manufacturing)
Work closely with the sales team to understand customer requirements, develop tailored solutions, and assist with formal proposal development and custom product quotes
Oversee multiple customer opportunities while focusing on key priorities
Mentor and coach junior field application engineers as needed
Travel as needed (up to 25–30%) to customer sites and internal meetings, including in the US, Mexico and Asia
Perform other duties as requested or assigned

Qualification

Thermal EngineeringMechanical EngineeringLiquid Cooling SolutionsTechnical PresentationsCross-functional CollaborationProblem-solvingAnalytical SkillsBilingual EnglishBilingual MandarinCommunication Skills

Required

Bachelor's degree in mechanical or Thermal Engineering, or a related field required
Minimum 5+ years of relevant experience in thermal/mechanical field applications engineering
Proven success supporting enterprise, OEM, or technology partners in the design and implementation of complex solutions
Demonstrated ability to work cross-functionally with R&D, product management, and customer engineering teams
Excellent communication and presentation skills with the ability to translate complex technical concepts for diverse audiences
Excellent communication skills, intrapersonal skills, and presentation skills
Strong capability in conveying complex technical concepts to stakeholders at all levels
Excellent problem-solving and analytical skills
Bilingual proficiency in English and Mandarin Chinese required

Preferred

Master's degree preferred
Any liquid cooling solutions experience is preferred

Company

Foxconn E BG Group

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E Business group has more than 50,000 employees, with a global footprint that includes the United States, China, Taiwan, and over 10 other countries, with functions including R&D, sales, manufacturing, supply chain management, products and services extending into IT product manufacturing (computers, printers, printer cartridges, monitors, game consoles, and wireless speakers), industrial PCs, after-sales services, recycling, peer-to-peer digital payment platform, and strategic investments, on behalf of customers to provide an end-to-end, one-stop solution for R&D, manufacturing, sales/marketing, and after-sales services.

H1B Sponsorship

Foxconn E BG Group has a track record of offering H1B sponsorships. Please note that this does not guarantee sponsorship for this specific role. Below presents additional info for your reference. (Data Powered by US Department of Labor)
Distribution of Different Job Fields Receiving Sponsorship
Represents job field similar to this job
Trends of Total Sponsorships
2025 (3)
2024 (1)
2023 (2)
2021 (1)

Funding

Current Stage
Late Stage

Leadership Team

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Yuping Chu
PROJECT MANAGEMENT/ VP AND THE DIVISION DIRECTOR'S
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Company data provided by crunchbase