Foxconn E BG Group · 1 month ago
Thermal/Mechanical Field Application Engineer
Bellevue, WA
Full-time
Onsite
Mid Level
3+ years expFoxconn E BG Group is the world’s largest electronics manufacturer and a leading provider of technological solutions. The Thermal/Mechanical Field Application Engineer will provide technical support for customer design and engineering teams, facilitating the integration and application of the company's products while acting as a liaison between R&D and client-facing functions.
Consumer Goods
Responsibilities
Provide application and product-level support to clients, including AWS, Microsoft, Meta, and other partners in the Greater Seattle area
Collaborate with customer engineering teams on integration, debugging, and performance optimization
Translate client technical requirements to internal R&D teams
Deliver product training, demos, and documentation to customers
Act as primary technical point of contact during pre-sales, evaluation, and post-deployment phases
Analyze and resolve field issues and recommend solutions
Create field reports, support documentation, and provide feedback for continuous improvement
Determine customer requirements (both explicit and implicit) and accurately communicate them back to key engineering team members
Drive product design development incorporating design rules, performance optimization and manufacturing for HVM (high volume manufacturing)
Ability to manage multiple customer opportunities simultaneously and prioritizing actions appropriately
Must understand customer design cycles to drive our product design-in opportunities
Leverage extensive personal experience in thermal/mechanical/electrical design and material science to become a trusted partner for our customers
Will support all required rework in US & Mexico if required. Travel US Domestic, Mexico & Asia as needed
Traveling with our commercial team, the Field Application Engineer will be the primary customer interface for all technical discussions
Perform other duties as requested or assigned
Qualification
Required
Bachelor's degree in mechanical or thermal engineering, or related field
Minimum 3–5 years of relevant experience as thermal applications engineer, mechanical engineer or related in field applications, systems integration, or embedded systems
Excellent communication skills and interpersonal skills
Fluency in Mandarin required
Self-motivated personality
Preferred
Any liquid cooling solutions experience
Company
Foxconn E BG Group
E Business group has more than 50,000 employees, with a global footprint that includes the United States, China, Taiwan, and over 10 other countries, with functions including R&D, sales, manufacturing, supply chain management, products and services extending into IT product manufacturing (computers, printers, printer cartridges, monitors, game consoles, and wireless speakers), industrial PCs, after-sales services, recycling, peer-to-peer digital payment platform, and strategic investments, on behalf of customers to provide an end-to-end, one-stop solution for R&D, manufacturing, sales/marketing, and after-sales services.
10001+ employees
H1B Sponsorship
Foxconn E BG Group has a track record of offering H1B sponsorships. Please note that this does not
guarantee sponsorship for this specific role. Below presents additional info for your
reference. (Data Powered by US Department of Labor)
Distribution of Different Job Fields Receiving Sponsorship
Represents job field similar to this job
Trends of Total Sponsorships
2025 (3)
2024 (1)
2023 (2)
2021 (1)
Funding
Current Stage
Late StageLeadership Team
Yuping Chu
PROJECT MANAGEMENT/ VP AND THE DIVISION DIRECTOR'S
Company data provided by crunchbase