Broadcom · 1 month ago
IC Package Mechanical FEA Engineer (R&D)
USA-Colorado-Fort Collins-4380 Ziegler Road
Full-time
Onsite
Senior Level
$127K/yr - $203K/yr
7+ years expBroadcom is seeking an experienced package mechanical FEA engineer for very-large and complex packages for industry-leading ASICs. You will be part of a worldwide R&D team developing high-performance package designs for ASICs for artificial intelligence (AI), networking, high-performance computing (HPC), and 5G base stations.
MobileSemiconductorWireless
Responsibilities
Design responsibility for mechanical design aspects of ASIC packages
Use advanced FEA to quantify and optimize reliability and manufacturing
Measure and experiment to validate understanding and improve model accuracy
Collaborate closely with package designers, reliability and manufacturing partners (internal and external)
Schedule, prioritize, & track your work across 4+ projects simultaneously
Create presentations for and present to various audiences : engineers, managers, senior management, customers, and vendors
Document design rules and guidelines
Qualification
Required
Bachelors in Mechanical Engineering or similar field and 12+ years of experience in FEA modeling or Masters in Mechanical Engineering or similar field and 10+ years of experience in FEA modeling or PhD in Mechanical Engineering or similar field and 7+ years of experience in FEA modeling
Ability to evaluate complicated numerical simulation results against first principles such as strength of materials solutions
Ability to calibrate modeling and results with existing empirical data
Perform mechanical testing and measurement
Devise lab scale tests to validate analyses
Seek mechanical solutions at the intersection of manufacturing limitations, required reliability and customer expectations
Cooperate with our world-wide team (multiple time zones), including co-design with internal team members and external (Vendor) designers
Self-management and organization skills
Presentation and technical documentation skills
Preferred
Ansys Classic/Mechanical experience is preferred. Equivalent tool is OK
Benefits
Medical, dental and vision plans
401(K) participation including company matching
Employee Stock Purchase Program (ESPP)
Employee Assistance Program (EAP)
Company paid holidays
Paid sick leave
Vacation time
Paid Family Leave
Company
Broadcom
Broadcom is a designer, developer, and global supplier of a broad range of analog and digital semiconductor connectivity solutions.
10001+ employees
H1B Sponsorship
Broadcom has a track record of offering H1B sponsorships. Please note that this does not
guarantee sponsorship for this specific role. Below presents additional info for your
reference. (Data Powered by US Department of Labor)
Distribution of Different Job Fields Receiving Sponsorship
Represents job field similar to this job
Trends of Total Sponsorships
2025 (92)
2024 (77)
2023 (79)
2022 (112)
2021 (110)
2020 (89)
Funding
Current Stage
Public CompanyTotal Funding
unknown2017-10-31Post Ipo Equity
2015-05-28Acquired
1998-04-17IPO
Leadership Team
Greg Singh
CTO for APJ, Enterprise Security Group
Kirsten Spears
CFO and CAO, Broadcom
Recent News
2026-01-07
Company data provided by crunchbase